Electronics Forum: /02 (Page 271 of 1282)

BGA Profile

Electronics Forum | Wed Feb 24 10:53:20 EST 1999 | Richard

I am profiling a BGA for the first time and I am seeing temperature flucuations on the ramp and cool down from the thermocouple I have placed through the pcb and under the component. I am using a 5 zone convection oven.Any suggestions on the ploblem

IPC610 spec's.....Am I the only confused one???

Electronics Forum | Wed Feb 24 07:56:53 EST 1999 | Brian C

Under IPC-A-610 Section 10.3(Components on their sides) it reads: ______________________________________________________ Acceptable - Class 1,2 Nonconforming Defect � Class 3 Chip components on its side provided the following are met: Chip

Re: IPC610 spec's.....Am I the only confused one???

Electronics Forum | Wed Feb 24 10:56:12 EST 1999 | Steve Schrader

| Under IPC-A-610 Section 10.3(Components on their sides) it reads: | ______________________________________________________ | Acceptable - Class 1,2 | Nonconforming Defect � Class 3 | | Chip components on its side provided the following | are

Re: Contact Systems vs Multitroniks: Who's better???

Electronics Forum | Wed Feb 24 09:16:53 EST 1999 | Mario

I bought 4 pick and place in the last 4 years. One of them was a Contact 3AV with QFP tray. Call me Mario Tel: 514-421-0358 Fax: 514-421-1278 514-421-0358

Solder Paste Vs Solder Paste Cartridges

Electronics Forum | Mon Feb 22 11:00:28 EST 1999 | Bill Haynes

Can anybody give me the Pros and Cons of of using Cartridges over jars and/or vice-versa. Also, if using cartridges, what is the best way to keep the paste from seperating, short of buying a mixer that cost over $5000.00 Thanks, Bill

Re: Solder Paste Vs Solder Paste Cartridges

Electronics Forum | Thu Feb 25 03:49:16 EST 1999 | K

Hi Earl , Have you already got ProFlow installed on your DEK Machines ? - if so I would be interested to hear any feedback on it. That goes for anyone else using the system - or in fact the MPM Rheopump. K

yield of glued 0603:s

Electronics Forum | Mon Feb 22 10:19:23 EST 1999 | Mattias

Hello Is there anyone who can give me some information regarding yield from gluing 0603 Is there any other problems that you might have had.

Printing

Electronics Forum | Fri Feb 19 14:09:08 EST 1999 | Bob Barr

When I print a message on the forum, the rightmost part of the page is truncated and the last half dozen letters or so do not print. Is there a way to print just the message without the menus on the left side? Thanks, Bob

Aperture sizes for printing SMD adhesive

Electronics Forum | Fri Feb 19 03:57:48 EST 1999 | Mark Alder

Please could you suggest a recommended aperture sizes for printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated.

Re: Tombstoning

Electronics Forum | Tue Feb 23 16:05:46 EST 1999 | Randy Haller

| What to look for that causes tombstoning and the corective action. | 1:check reflow profile 2:reduce pad size 3:reduce deposition of paste(stencil thickness/opening of aperatures) 4:Check components for solderability Good Luck


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