Electronics Forum | Mon Feb 26 19:05:32 EST 2007 | KEN
Is there a typical DI cleaner (washer) bath/ spray temperature? (In-line cleaner) Is there a maximum temperature? I know some parts do tend to have issues like TH electrolytic jackets shrinking. But is there any situations to be aware of? Bacteri
Electronics Forum | Tue Feb 27 07:41:15 EST 2007 | realchunks
Depending on your D.I. system, your maximum temperature concern may be at what temperture it returns to your D.I. system. Hot water may foul you set-up very quickly. As for maximum tempertures for parts, your biggest concern should be drier section
Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks
Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem
Electronics Forum | Wed Feb 28 17:00:35 EST 2007 | jasont
Dimensions (L X W x H): 1650 x 1302 x 1820mm (5.4 x 4.27 x 6ft) Weight: 700 kg (1543 lb). from manual of CMS 84vz. If you do not get the one on ebay, let me know if you are interested in the one I have in Canada.
Electronics Forum | Tue Feb 27 20:42:56 EST 2007 | pyramus
Hi anybody have experience with the Package on Package BGA components. I mean BGA over a BGA component assembly. Our R&D is requesting us feedback for the future usage of this part. Need to gather some info on possible SMT issues for usage of this B
Electronics Forum | Wed Feb 28 07:40:26 EST 2007 | realchunks
Hi Roderick, Guess it depends on how you define "minor". If it is just a visual blemish in the mask, there will be no affect o the BGA. If it is through the resist there may be a chance of solder shorting, which will affect it, I doubt it but poss
Electronics Forum | Fri Mar 02 11:32:06 EST 2007 | ausajid
hi thank you for your rely. i think you are right. but there may be an option. i have ask from universal people the other day. they said, they will check from their engineers/highly qualified people and than reply. let see what they suggest. thank
Electronics Forum | Fri Mar 02 10:00:11 EST 2007 | jseagle
Check out ECS refining, they will recycle your paste and dross and cut you a check. We usually send 1 55 gal drum of dross and 1 55 gallon of waste and get a check back for ~$150. You can also contact the solder suppliers they usually have recycle
Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
Electronics Forum | Fri Mar 02 16:26:57 EST 2007 | Steve
1- Thickness 0.005" 2- I usually reduce 50% of the thermal pad, but it also depend on original size of thermal pad somehow I have to either create window panel or crosshatch otherwise component wil get wimming during reflow. Hope this will help. Reg
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