Electronics Forum: /03 (Page 236 of 1347)

Standarts in production line

Electronics Forum | Tue Mar 22 06:03:55 EST 2005 | Base

Try the IPC-254x CAMX standards (webstds.ipc.org, no www prefix!). They define a set of generic and process-specific XML messages for equipment to send out all sorts of process-related events. I know there are standardized messages for print, dispens

Looking for maint. manual for a treiber 700B-160 Wave Solderer

Electronics Forum | Tue Mar 29 14:03:25 EST 2005 | Ed Popielarski

Hi, Steve Gregory brought your post to my attention although I'm not a regular participant in SMTNET. I am an independent service provider and still work on the Treiber systems as well as many other process equipment types and brands. I probably hav

How to get away jointing problem

Electronics Forum | Sun Apr 03 03:48:05 EDT 2005 | iwan

I have a problem in my Lead Free smt production line,i run BGA product for the first time. The product consist BGA and Connectors. If i increase temperature in Reflow Oven it will be melting the Connector, but when i decrease the temp. BGA become raw

OSRAM Power TopLEDs with dome

Electronics Forum | Mon May 02 18:07:32 EDT 2005 | Moe

Has anyone developed a custom nozzle for these guys? http://www.osram.convergy.de/upload/documents/2005/03/03/14/47/LA_LO_LS_LY_E63B.pdf I've found that there is a deposit of epoxy at the base of the lens that can sometimes cause the LED to lodge in

Recommended max board temp for BGA repair

Electronics Forum | Fri Aug 12 03:54:03 EDT 2005 | Mika

Does the pcba:s comes directly from the assembly line, You are going to do rework on? If faulty pcba:s comes back from, let say a customer from outside or the pcba:s has been on Your shelf for some days/weeks, exposed to open environment (humidity in

Should I panic over .5mm pitch BGA?

Electronics Forum | Wed Aug 31 09:06:11 EDT 2005 | PWH

Agree with Siverts. We do a build that has 0.3mm pad diamter BGA (0.8mm pitch - distance from pad center to pad center) and 0.5mm dia. BGA balls. Stencil specs. are: 5 mil. thickness, square BGA pad aps. (1:1, 0.3mm square aps), laser cut. Seems

testing smt boards

Electronics Forum | Sat Dec 03 03:56:47 EST 2005 | hamidrezamaddah

Primary methods used to test circuit boards > are: * Automated test equipment [ATE] * Manual > bench-top functional test equipment > > Printed > circuit board ATE market segments are: * > In-circuit ATE * Functional ATE * Boundary > Scan ATE

Need opinion about KE740 and KE760 !

Electronics Forum | Tue Jan 03 03:08:36 EST 2006 | Frank

To answer your compatibity question. I am assuming you have a 730 already... The 760 can always open the 730 files, but depending on the software verion on the 730 the 730 may not be able to open the 740/760 files. If your 730 has version 5 or hig

Thermal Profiler Batteries

Electronics Forum | Fri Mar 03 20:45:58 EST 2006 | KEN

I have used KIC data acquisition equipment for over 11 years. Slim kic, sideKic and Kic2000, prophet etc... The 9 volt battry changes in seconds. Gimme a break. The internals don't reach 54Celsius. If it came down to batteries, I bet KIC would t

Thermal Profiler Batteries

Electronics Forum | Sat Mar 04 03:39:57 EST 2006 | grantp

Hi, I agree, we have a KIC and have run hundreds of profiles and are still running the original battery and have never had a problem. The software is what matters with profilers I think, and the KIC has really good software that shows you a process


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