Electronics Forum | Thu Jun 24 09:24:03 EDT 2004 | Rob
The smallest component we use is 0402. Solder paste is Kester 256. Printer is MPM Ultraprint 2000. Stencil is 6 mil. I didn't here anything bad (rework or whatnots) in terms of soldering of those components.
Electronics Forum | Sat Jul 03 02:13:01 EDT 2004 | yukim
The manufacturer says that since this solder paste has synthetic flux (not natural rosin) it is sensible to humidity. Worked with reflow profiles, but no remarkable improvements. We are changing solder paste every 2 hours.
Electronics Forum | Tue Mar 08 09:02:20 EST 2005 | Rob
Steve Ferdenzi @ Mission Impossible does repairs. missionpossible@btconnect.com +441706 830301 Cheers, Rob.
Electronics Forum | Sat Jul 03 11:10:48 EDT 2004 | KEN
??? Two assemblies assembled under the same conditions with identical x-ray results can have dramatically different life expectencies. Operating environments will have a direct affect on the product ie. hunidity, temperature swing, temp. duration, v
Electronics Forum | Fri Jul 02 03:51:14 EDT 2004 | HARAN
I was told by my boss that the new product will be transfered to my facility will have the Super BGA and Hyper BGA.Can I know what is the difference of these 2 components compared to normal BGA.Is there any difference in the assembly process and requ
Electronics Forum | Tue Jul 06 19:45:03 EDT 2004 | ANDREW
Based on the attchment it looks like both are low profile and cater for high IO point.What are the challenges in running this 2 type of component?Is there any additional process required other than normal SMT for these 2 packages,like underfill ?
Electronics Forum | Mon Jul 05 03:14:47 EDT 2004 | P.V
I am looking for the solder pot size on the above wave machine, any help would be appreciated
Electronics Forum | Tue Jul 13 21:17:03 EDT 2004 | adiaz
Vinnie, Thank you for the information, I will contact them and hope we can have a deal! Once again, thanks! Alfredo
Electronics Forum | Fri Jul 16 03:40:17 EDT 2004 | Rama
We are going to start producing product that require us to assemble Stacked BGAs. My question - how to rework this package, as the the process of either removing or re-placing them onto the PCB will the effect the BGA sitting on top of it. Pls help.
Electronics Forum | Fri Jul 16 11:04:03 EDT 2004 | Rush Fan
We are considering the purchase of equipment that would allow us to inspect beneath various components such as BGA's. Does anyone have any thoughts, good or bad, on the offerings of equipment currently out there on the market?
