Electronics Forum | Wed Mar 05 16:58:40 EST 2003 | msivigny
Hello Kris, No, it's not necessary to have a nitrogen tunnel setup. A nitrogen tunnel allows a process to go the extra step in providing higher quality through less defects. I can't really speculate on it's use in contract manufacturers mainly becaus
Electronics Forum | Thu Mar 06 07:40:42 EST 2003 | g hunter
hello, i wondering if anyone can help me with a problem we have. i'm looking to purchase a SMT counter. were looking for a moterised one with a empty pocket detection system, i have had one on load from a company already and it was a bit poor so any
Electronics Forum | Mon Mar 10 16:29:09 EST 2003 | julief2000
Kevin, The Technical Devices Machine, the EVS is a stand alone system that can reclaim up to 75% of the dross weight as usable solder. It has a much more proven history than the Electrovert add on, as well as being lower priced. The Technical Devi
Electronics Forum | Thu Mar 06 10:57:28 EST 2003 | Mark
What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. And direction of squeegee print over the aperture? Recommended Stencil thickness? Recommended aperture reductions? Recommended pcb pad sizes? Recommended
Electronics Forum | Fri Mar 07 21:10:31 EST 2003 | neil
Remember the gold is only deposited to provide an air barrier so that the nickel does not oxidise. Normally the gold is absorbed into the solder joint so that the solder forms a joint with the nickle. It is not unusual to see gold remaining on pads i
Electronics Forum | Wed Mar 12 22:39:58 EST 2003 | MA/NY DDave
Hi Thanks more than you know for your honesty. Honesty adds 200-300% value in my book of all times. I am glad your problem was so easily solved, and I agree that you did the right thing by appologizing to your PCB supplier. Great, Lets move on Y
Electronics Forum | Thu Mar 06 14:10:26 EST 2003 | gregp
Hello Mike, The IPC has recently released a specification (IPC-9850) that characterizes the performance of placement machines. The process is very similar to the process you describe (placing parts on a glass plate and measuring the results). The I
Electronics Forum | Wed Mar 12 09:31:55 EST 2003 | MA/NY DDave
Hi Greg, You sound like a buyer or procurement professional. Everything you listed is OK, and more or less. Quite often Engineering Design or Product Management in the OEM establishes what they feel are some of the basic T&Cs. I guess I would ask
Electronics Forum | Thu Mar 13 14:05:21 EST 2003 | clarkk
Gregory, Check out IPC document EMSI-TC2. It is available for purchase on the IPC website (www.ipc.org/) and covers the items you mentioned, as well as many others. The only thing we add to it is an arbitration clause that we wrote with help from the
Electronics Forum | Tue Mar 11 10:13:15 EST 2003 | genny
Some people have said that for smaller components like 0402, a 2% silver paste (62/36/2)has helped reduce the tombstones. The reasoning is that this paste has a longer plastic zone compared to a true eutectic solder, and if there is any uneven heati
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