Electronics Forum | Fri Dec 03 12:01:14 EST 2004 | mruzicka
AOI (automatic optical inspection) is not capable to detect hidden joints (BGA, J-leads,...) defects. For that you will need X-Ray (AXI = Automated X-ray Inspection). Look @ http://www.agilent.com, they have both systems. It is usual that PWB manufac
Electronics Forum | Fri Dec 03 15:56:47 EST 2004 | Indy
Hi Everyone, Could someone please tell me - What happens if a N-type connector having chromate coating over silver plating is hand soldering to a PCB. Does the Chromate coating form a compound with silver, Or does it come off while cleaning excess
Electronics Forum | Tue Mar 15 13:24:44 EST 2005 | pjc
There is equipment available to clean NC residues off low standoff devices, well below 0.8mm (0.031"), from Speedline Technologies- Electrovert and Accel. See this paper under Accel: "High Reliability Underfill Performance through Proper Flip-Chip D
Electronics Forum | Wed Mar 16 06:52:00 EST 2005 | Bob R.
I won't speak for the person asking the original question, but one reason I can think of is in a high reliability application where the CSP needs underfilled and, depending on the underfill, cleaning may be necessary for underfill adhesion. Why use
Electronics Forum | Tue Dec 07 15:03:16 EST 2004 | Nat
Hi all, We have an Omniflow 7 reflow oven that has not come with the nitrogen option. We are looking at fitting a nitrogen system to the oven, does anyone have nay knowledge that may help us? The cost of the nitrogen is nothing as we outgas enourmou
Electronics Forum | Tue Dec 14 09:53:03 EST 2004 | paul_fisher
Yep fully functional and failed during the test. 25 to 55C in 3 hour hold for 9 hours then 55C to 25C in 3 hours hold for 9 hours then repeat. Humidity at 95 percent! Boards only part conformally coated. Growth with and without the coating. seems to
Electronics Forum | Mon Jan 03 12:26:16 EST 2005 | barryg
We are looking at potentially doing a pcb that is enig finished as called out on its fab. drawing. We plan on a standard 63/37 water soluble paste. Is there any pro's and cons to this process with a pcb plated as such. What is the main advantage that
Electronics Forum | Thu Jan 06 09:03:57 EST 2005 | russ
It appears that this particular PCB supplier has a non-optimum HASL process along with other issues. It is much harder to completely remove the solder out of vias on thicker boards. Looks like more air pressure was needed to remove all of the exces
Electronics Forum | Tue Jan 11 03:43:51 EST 2005 | Scott B
We have had similar problems and have abandoned use of MySpeed. I don't know what version of Mydata software you are running but have started to use the 'Hydra Preparation' function within TpSys 2.3 to arrive at optimised set-ups. Mydata advise that
Electronics Forum | Thu Feb 03 23:06:58 EST 2005 | KEN
I have a Micro Focus with digtal upgrade and fine resolution beam. This system is used to inspect BGA+1500 devices. In fact I can see the flat spots where the device interfacial occures. Check with focalspot...these guys have tons of experience in