Electronics Forum | Mon May 30 03:13:49 EDT 2005 | Joris Groot Koerkamp
Hi rob, We use the component for a long time and never had a problem with the reflow process. Since the component is Leadfree we see the problems. We have the same problem with defferent pcb's. The tin not always flows to the same direction. I check
Electronics Forum | Fri Jun 03 05:31:21 EDT 2005 | grantp
Hi, Yes, and I mean to update that old thread. Things are working really well now we have changed over. Looking for a buyer for the MYDATA now, and we are going to unload the vapor phase and manual printer, and some long conveyers. Need to add it al
Electronics Forum | Mon Jul 03 22:48:42 EDT 2006 | eyryren
Dear ve7khz We are the manufacturer of SMT accessorial material.stencil clean roll and splice tape.We are can manufacture many style stencil clean roll for kinds of screen printer machine and splice tape special for kinds of placement machine. If yo
Electronics Forum | Sat May 28 06:43:03 EDT 2005 | steve
I have the ability to offer both SAC and SN100C lead free alloys to my customer base. What might occur if a customer is already using SAC305 in their wave and they want to save money and go to SN100C. They now are mixing, tin,silver,copper with tin,c
Electronics Forum | Wed Jun 01 03:49:30 EDT 2005 | devilhitam
I'am having a problem with 0805 component where right after placement, the component tend to move from the pad. I'am using 'horse shoe' aperture for 0805 component to resolve the solder beading issue. Does this 'horse shoe' contributing the skew/shif
Electronics Forum | Fri Jun 03 14:55:15 EDT 2005 | Bman
Both our Quad ZCR and our Conceptronic HVN-102 ovens have had blowers out with no alarms raised. We knew there were problems based on how boards were soldering, but don't count on your oven to tell you if anything is wrong with it. We verify once a
Electronics Forum | Fri Jun 03 14:31:33 EDT 2005 | Peter
I am working on an application requiring removing BGAs from a board coated with parylene. These BGAs have low standoff with less than 0.015" after SMT soldering. Can some comment on a reliable and consistent process to perform such rework? given tha
Electronics Forum | Mon Jun 13 18:03:45 EDT 2005 | peter ng
Dear James 1)Standby the part for next model. 2)during the convention period,replaced the part for the machines. 3)All the programme are following the CAD data.It's help to reduced the situation. 4)All the feeder must be in the good condition. 5)The
Electronics Forum | Thu Jun 23 03:43:45 EDT 2005 | ajaydoshi
Hi Jerry, > > Thanks for the info. Is vision > number required for the IP3? From the manual it > appears not (needed for IP1 & 2), however vision > type is required. > > Thanks, Dave We are using IP3 & placing BGA. BGA part data only for outer
Electronics Forum | Wed Jun 22 15:03:12 EDT 2005 | patrickbruneel
The only thing ammonia can do is tarnish copper and make it more difficult to solder. And the higher temp in lead-free will discolor the latex (giving it a sticky surface), but the functionality of the mask will be intact. There should be greater co