Electronics Forum: /03 (Page 916 of 1347)

Bottom side process question

Electronics Forum | Tue Mar 13 18:25:45 EST 2001 | slthomas

Anyone doing a print-dispense-place-reflow process? I've never heard of it being done this way before today. Don't know why, actually, as it sounds like a fairly friendly method provided the adhesives used are happy with a standard reflow profile.

Paste life span on the printer

Electronics Forum | Wed Mar 14 01:45:46 EST 2001 | Yngwie

In my factory, we are setting the shelf life of paste on the printer to be 2hrs. What is the best way to measure this and when does the 2 hr start? It is quite difficult as sometimes the line is down for 1 hr and then start again. Should we cummulat

Paste life span on the printer

Electronics Forum | Wed Mar 14 09:07:34 EST 2001 | blnorman

We just ran a study to try to determine this. We exposed the paste to 85% humidity to simulate worst case manufacturing. At various times we removed the paste from the chamber and tested it for tack, solder balling, wetting (copper coupon), and vis

Removal of Hot Metal Shield for Rework

Electronics Forum | Wed Mar 14 05:23:43 EST 2001 | Bach Huss

Hi, I was wondering what tool there is in the market for shield removal. We are heating up the shield with a hot gun, and using a tweezer to remove the shield, I have a concern that this might have high posiibility that the components under the shie

Removal of Hot Metal Shield for Rework

Electronics Forum | Wed Mar 14 09:16:45 EST 2001 | gsmguru

In the past I've removed shields with a dedicated hot air machine. (Similiar to an SRT) This machine could remove and replace shields using a stereo microscope and a positioning system. Basically a special nozzle is designed for each type of shield.

BGA X-Ray inspection question

Electronics Forum | Wed Mar 14 16:30:02 EST 2001 | CAL

Reading x-rays is an art. All balls should be symmetrical in size and shape. Please provide more information on your question. Why just opens? If the Balls are not consistently the same in size or shape there is a problem. Larger balls could be from

Ready, Shoot, Aim!!!!

Electronics Forum | Thu Mar 15 16:49:16 EST 2001 | mparker

Whew, what set you off, amigo? You're absotively on target. Those book authors are writing to their own peer group audience, therefore all you get is techno geek jargon. It takes a seasoned (basted lightly)veteran to interpret. You know, the battle h

Ready, Shoot, Aim!!!!

Electronics Forum | Wed Mar 21 07:07:24 EST 2001 | bobnelms

Michael If I understand your note correctly, I certainly agree with some of it and disagree with some of it. Of course we all need to be able to communicate with whomever we have in front of us -- to speak and write at their level, etc. But to hel

Ready, Shoot, Aim!!!!

Electronics Forum | Wed Mar 21 16:19:23 EST 2001 | mparker

Having re-read my message I do not know where you deduced "quick", unless you are taking "minimize mean time to trained and effective" as being I want the fast food version. What I mean is what you already agree with, make the information available

Upside Down Chips

Electronics Forum | Thu Mar 15 05:59:08 EST 2001 | PeteC

Good point. I'm having trouble with the words "electrical elements" in the J-STD. Is a marking an "element" ?? An upside down chip resistor is certainly not a defect in that it does not negatively impact product functionality or dependability. I sugg


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