Electronics Forum | Wed Mar 31 09:05:36 EST 2004 | russ
That would be one BIG spreadsheet, there are a lot of mfg with a lot of components for each one. As you know when going to the datasheetlocator you notice the huge listing of suppliers (500+) each one of them probbaly has anywhere from 1 type of co
Electronics Forum | Fri Mar 26 08:49:22 EST 2004 | patrickbruneel
Dear Sir, If you are looking for the best bang for the buck you will have to stop cleaning and use a no-residue paste instead of a no-clean. No-residue chemistry becomes totaly volatile in dwell time above reflow resulting in residue free boards. I
Electronics Forum | Fri Mar 26 10:23:55 EST 2004 | Mike Konrad
Patrick, When you say "no-residue" what exactly do you mean? Is there truely "no-residue" or is it "no visible residue"? What type of ionic contamination results have you experienced? If you take a bare board that measures 0.0 NaCl and reflow it
Electronics Forum | Fri Mar 26 11:13:04 EST 2004 | Mike Konrad
jdomont, No-cleans are more difficult to clean than RMA�s. Even though no-cleans have a lower solids content than RMA�s, reflow and soldering profiles are normally more severe than those used for RMA. It is interesting to note that our most of our
Electronics Forum | Fri Mar 26 13:32:37 EST 2004 | patrickbruneel
Mr. Dumont I want to be very clear on a couple of points. The intention of my response to your thread was to bring you a solution for your problem "free of charge" The no-residue is not developed yesterday. The no-residue is developed in 1988. Becau
Electronics Forum | Mon Mar 29 14:58:08 EST 2004 | davef
Josh: Final cure of the LPI solder mask: 310*F for 45 minutes. Your board fabricator needs to do a better job. Most fabs do not check cure, because the processes subsequent to cure are so brutal that the fab expects the following process to highlig
Electronics Forum | Wed Mar 24 15:15:35 EST 2004 | davef
I think you can effectively clean under any other low standoff device. It's an issue of surface tension, pressure, and flow rate. DI water is the starting point, but the surface tension of straight DI water makes it difficult to get under low stand
Electronics Forum | Thu Mar 25 18:54:16 EST 2004 | Mike Konrad
A surfactant (AKA detergent) is great for OA flux removal applications. It has a good surface tension reducing property and is more easily rinsed than soaps. If using a soap or surfactant, be sure that you choose one that has a good de-foaming pack
Electronics Forum | Wed Mar 24 12:36:26 EST 2004 | wintech
Hello We are using a No-Clean process for a lot of boards that we do, but the customer needs the flux removed off the bottom side of the board and there is to many leaded components that can not go through a water wash, so is what we do is clean th
Electronics Forum | Wed Mar 24 15:08:08 EST 2004 | John
I'm working on a new product soldering to a thick film material. We currently use only No Clean solder pastes. The vendor that supplies the substrate has suggested going to an RMA paste to improve solderability. We haven't used any, but I'm not fa
