Electronics Forum | Wed May 08 23:48:01 EDT 2002 | ianchan
Hi mates, someone told us to use mild HCL acid 5% to 10% solution and submerge the LCC parts into this solution. hopefully this will clean off the varient copper oxide layer on the LCC leadless terminal wall. after the HCL soak, submerge the parts
Electronics Forum | Wed May 22 08:20:59 EDT 2002 | xzinxzin
*yes, I used water soluble solder paste (OMG-WS-300), the flux type is ORM0. The component terminations are bare copper,and they�re supposed to be that way. The supplier of these parts is MAXIM, produced from Philipine, get from customer. * We can no
Electronics Forum | Tue May 21 08:26:14 EDT 2002 | stefwitt
without knowing your machine, I guess the axis does not find the zero pulse. You may have to re-place the incremental or linear encoder for the X-axis. Some vendors use proximity switches for a zero pulse which could be defective. If the axis stops i
Electronics Forum | Wed May 29 19:00:08 EDT 2002 | russ
Have been seeing a pretty fair amount ourselfs. it seems to come and go. Couple of questions 1. Are the parts shifting to one side during reflow? 2. is it true non wetting to the component? I have been experimenting with different pad geometries a
Electronics Forum | Thu Jun 06 08:54:37 EDT 2002 | davef
While loosing traction, lead-free is a fait accompli. The 'greens' rule Euroland and the rest are sheep, too fat and content to realize what's happening. While not addressing your question on strength directly, National Electronics Manufacturing In
Electronics Forum | Sat Jun 08 07:06:21 EDT 2002 | cyber_wolf
At each of the machines we have a log book.One of the sections that the operators fill out in the log is called machine downtime, and next to it is a comment section.Any time the machine is not placing parts they make a quick note of why they are dow
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Thu Jun 13 11:25:40 EDT 2002 | davef
Help us understand your situation by telling us about: * Is this a terminal-to-terminal short on a single MELF? Or is this a terminal-to-terminal short between or than one MELF? * Clearance of 0.8mm is the distance between what features? * Size ME
Electronics Forum | Wed Jun 26 08:53:32 EDT 2002 | davef
We have not done a DOE on board warping. Consider: * How close the board gets to its Tg during the reflow cycle * Amount of copper on each side and the balance between the two * Thickness of the board * Overall length x width * Time at temperature
Electronics Forum | Tue Oct 01 08:01:23 EDT 2002 | mjz289
WE USE A HELLER 1500 EXL OVEN (5 ZONE OVEN) AND HAVE BEEN DOING PBGAs FROM 292 TO 780 BALLS WITH .O32" PITCH (.8 mm) AND METAL STIFFENERS ON TOP WITH NO PROBLEMS. I AM GETTING 210 - 215 DEGREES C AT THE BGA BALLS WITH 50 - 65 SECONDS ABOVE LIQUIDUS
