Electronics Forum | Tue Apr 08 11:52:34 EDT 2003 | Chrissie
I am currently trying to creat a model to calculate attrition on our SMT line. A new product is coming into our cleanroom and we have problems with the current product and atttrition levels. One of our main problems is a large batch for us (space ind
Electronics Forum | Fri Apr 11 16:07:08 EDT 2003 | daanterstegge
I'd say your profile is about right, assuming these are values that you measured in the balls of this BGA and not elsewhere on the board. If you want a more shiny joint than use a nitrogen oven or experiment with various solder pastes, but why the he
Electronics Forum | Thu May 08 10:43:03 EDT 2003 | stimpy
Nice sugestions from all.. but one simple solution that you should practice from here on out.... CFM... If you would have built up your process, you would have found the flawes there early allowing you to correct the process flow. I would use CFM on
Electronics Forum | Wed Apr 30 08:00:33 EDT 2003 | pjc
Jason, In Transmission AXI the entire solder joint volume is imaged, not just a slice (no missing information) as with Cross-Section. Also, there is no signal loss from mechanical or digital image reconstruction (highest contrast and edge strength).
Electronics Forum | Wed Apr 16 08:51:10 EDT 2003 | russ
You don't need to guess at belt speed, for example if your oven (heating area) is fifteen feet long, run at 1 ft./min that will be 15min total process time. As far as temp profiling you need to run T/C because each oven is different even if it is th
Electronics Forum | Sun Apr 20 08:27:21 EDT 2003 | davef
Your link doesn�t work. It gives an application timed out message. Pads on the board that are too large or spaced improperly for the component usually cause skewing. Tombstoning and skewing are first cousins. Look here: http://www.smtinfocus.com
Electronics Forum | Wed May 07 18:08:10 EDT 2003 | kent_peterson
Steve, I onlyworked on the soft beam for a few months. With a good operator it ran good. The biggest problem i saw was the solder would break. The operators would try adjusting and end up moving the solder point. We had two machine back to back one r
Electronics Forum | Thu May 22 08:46:05 EDT 2003 | Henry Lee
Hi I uploaded the photos http://hk.photos.yahoo.com/ee02lyk of the failure samples. The chip-cut and pin-hole were found after the manufacturing process. I initially suspect the crack happened during the reflow process.However, our factory analysis d
Electronics Forum | Thu May 29 08:28:16 EDT 2003 | davef
Teradyne says, "How does one evaluate the competency of a particular AOI system? At the highest level, all potential customers must judge any viable AOI system using the following qualities: * Throughput must be able to match the line rate on the man
Electronics Forum | Wed Jun 04 13:05:31 EDT 2003 | JoeH
I may have the oppurtunity to purchase a AAT Microjet machine with the Mach II drying capability. I like the theoretical cleaning/drying capability and power consumption advantages this machine could give us. The relative small footprint is also a
