Electronics Forum | Fri Aug 22 10:20:26 EDT 2003 | Stephen
I hate being persnickity, I just am sometimes. You are not being told you "should expect" that variance. You are being told you can't sue them for manufacturing defects if the balls are within that range. That range is way bigger than what they wil
Electronics Forum | Fri Aug 22 15:49:40 EDT 2003 | paulm
Thanks Steve for your rather colorful and sarcastic input. If I correlate your asteroid assessment with what our QA Departments data(that tells us we are experiencing this problem about 5% of the time and I am guessing higher when we are forced or re
Electronics Forum | Tue Aug 26 14:13:46 EDT 2003 | robd
We have seen "coplanar problems" on BGAs supplied by some suppliers. We have seen large enough spere variation to cause opens with our standard .006" paste process (paste and profile work fine "most" of the time) . Although not an extremely technic
Electronics Forum | Thu Aug 21 17:17:47 EDT 2003 | justin
Do some push / pull testing. Typically with black pad, you can flick the components right off the board. If you have this, the boards are about as reliable as a Yugo. If you get decent push / pull results, odds are you don't have black pad and you
Electronics Forum | Thu Aug 21 22:47:39 EDT 2003 | adlsmt
Well after reading all kinds of stuff about this I still question if it is my current problem BUT, how common is this??? I dont want to be afraid of the boogie man but it seems like a lot of folks are having problems with black pad. I have used imers
Electronics Forum | Fri Aug 22 11:34:32 EDT 2003 | Stephen
Don't forget moisture senitive devices. If you have them on the bottom side, usually you do the other side before it is an issue, but if you are going to store the boards for a while it could be an issue. Where I am, partially building product then
Electronics Forum | Thu Aug 21 23:35:20 EDT 2003 | kennyg
For ICT purposes I may need to print solder paste on 0.015" test vias. No-clean is not an option for this assembly and OA seems the only choice. Can flux be safely removed from inside the via from the other side during a standard water wash process
Electronics Forum | Fri Aug 22 23:17:22 EDT 2003 | Hoss
Mike, Any chance these parts have been sitting around esposed to your factory's ambient conditions, not in a vacuum sealed bag or dry box? If they haven't, you may have parts with a high moisture content which could cause "potato chipping" you desc
Electronics Forum | Sun Aug 24 15:00:46 EDT 2003 | Handsome zhang
I am placing a plastic Cypress, 256 pin BGA on a > small assembly, and I cannot stop the corners > from bowing. I've moved my profile up and down > with no results. Any suggestions? Hi mike I am a staff of smt in ASUS(TAIWAN),I have a large in
Electronics Forum | Mon Aug 25 00:31:53 EDT 2003 | Dennis O'Donnelll
It could be moisture in the BGA. You should always bake the BGA before installation of course. But most likely you are usingf too much heat or too fast of a ramp speed. Make sure your top heater temp is below 230C. Set top heater to 220C, then adj
