Electronics Forum: /08 (Page 1251 of 1615)

White Solder Mask Discolored after Reflow Oven

Electronics Forum | Sun Aug 23 11:42:01 EDT 2009 | ysutariya

Hi Dave, I haven't tried the Probimer yet, but the Taiyo ink didn't hold up too well. As a PCB fabricator, finding a white soldermask that has good trace coverage and survives 4X solder immersion (HASL) is like the holy grail of white soldermask.

Vapour phase soldering - problem

Electronics Forum | Tue Aug 18 02:10:14 EDT 2009 | sergey2007

Hello, I have a customer who recentely installed a vapor phase soldering system. Everything goes pretty well, but from time to time the customer has the same problem with the soldering: one of the components on PCB (usually, it's a QFP package) is ro

Vapour phase soldering - problem

Electronics Forum | Wed Aug 19 18:28:01 EDT 2009 | ratsalad

I'd like to ask a question. Have you determined where all those solder balls are coming from? I even see them on top of U40 and U15. This seems like a dumb question to me considering the size of the part (and having seen pictures of only one boa

Vapour phase soldering - problem

Electronics Forum | Thu Aug 20 18:20:21 EDT 2009 | joeherz

Sergey, With that many leads and contact surface area points, it doesn't make sense that the part would move as it has without a gust of wind.... What is your confidence that you don't have an MSD issue on this part. Being that it is a TQFP, it's

Vapour phase soldering - problem

Electronics Forum | Wed Aug 26 03:21:00 EDT 2009 | sergey2007

Hi Graham, the MSD level of the component is 3. I am not sure that my customer properly stored the component before the soldering process. And I am not sure that it was dried at all. The customer says they did everything that they had to, but I just

Vapour phase soldering - problem

Electronics Forum | Wed Aug 26 05:22:59 EDT 2009 | grahamcooper22

Hi Sergey, I agree with your probable cause. Maybe if you still have a component you can bake it before reflow to DRY it. Then if the problem doesn't happen in reflow you have surely proved the cause. Consult IPC JEDEC 33B spec for storage and Drying

How many times can a component go through reflow oven?

Electronics Forum | Fri Aug 21 04:37:26 EDT 2009 | grahamcooper22

Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance.

Eutectic Solder On A Lead Free HASL PCB

Electronics Forum | Wed Aug 19 15:24:21 EDT 2009 | smt_guy

I have a customer who approved and asked us to process PCB's built with Lead-Free HASL Finish using Eutectic Solder. We did as directed and inspected the result from a 10-PCB Run and couldn't find any problem with solderability or issues. What Issue

Eutectic Solder On A Lead Free HASL PCB

Electronics Forum | Wed Aug 19 16:01:47 EDT 2009 | davef

You say, "using Eutectic Solder." * There are lots of eutectic solders. * When melted, a eutectic solder goes directly from a solid to liquid phase with no pasty phase. Do you mean 63/37 tin lead solder? If so, probably your assembly won't be RoHS

Eutectic Solder On A Lead Free HASL PCB

Electronics Forum | Wed Aug 19 18:18:02 EDT 2009 | smt_guy

Thanks Sir Dave. Yeah my apologies. To clarify, we built the product PCB whcih has a Lead-Free HASL Finish using a Sn63/Pb37 Solder paste. My major concern regarding reliability is that my profile whish is between 215'C-225'C was insufficient to ref


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