Electronics Forum | Thu Apr 08 10:04:08 EDT 1999 | Michael Bryant
Bob, Thank you for posting an extremely relevant technical question to the Forum. However, the entire message was posted in the subject line and the body was left blank. In the future, please use the subject line to summarize your message, and type
Electronics Forum | Mon Feb 08 08:33:27 EST 1999 | Clifford Peaslee @ SMTnet
Hello all, Now that we have the new site up, we know there will be some bugs here and there, so please email me, so that I can act quickly. Some known problems at this time: 1. web email: cannot read attachments, java folder view doesnt work on all
Electronics Forum | Wed Aug 04 12:08:16 EDT 1999 | David Lynch
Jim McCarten and Dave F, Jim - How about a little explanation on your PlacePro 7100 comments? I'd like to know what a "typical SMT board" is and how "thruput is cut in half" by assembling it. Is this typical SMT board something that most manufacture
Electronics Forum | Mon Nov 09 08:50:08 EST 1998 | Larry Johnson
Here is a good one for ya. Our IP3's MTU will not pick QFP240's out of cavities, 10, 12, 13, 15. This is a 3X8 tray. The listed cavities are also the closed cavities that are used for tray eject. There is plenty of vaccum, the nozzle comes down f
Electronics Forum | Mon Sep 28 08:08:30 EDT 1998 | Jimmy strain
| Does anyone out there have any pictures (jpeg preferred) of solder paste prints - or know where some are available. It will be awhile before our 35mm camera for our 3D scope arrives and I need some for inspection criteria. I need the good, bad, and
Electronics Forum | Thu Aug 27 11:08:30 EDT 1998 | Richard Scarcelli
| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is
Electronics Forum | Mon Aug 24 08:34:14 EDT 1998 | JUSTIN MEDERNACH
| Hi, | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | We have rule out the possibility of not printing any solder paste
Electronics Forum | Mon Jun 08 21:08:52 EDT 1998 | Dave F
| If any one needs a procedure for rework and repair of BGA there is a document on my Web Site to download www.bobwillis.co.uk | | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a sold
Electronics Forum | Tue Jan 27 08:08:51 EST 1998 | Jon Medernach
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
Electronics Forum | Mon Aug 06 10:08:55 EDT 2001 | davef
I like the blue search button better than the upper right search button, because it gives far greater hits that are more representative of the content of the forum. For example: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&&