Electronics Forum: /08 (Page 311 of 1615)

wave soldering + header connector assembling problem

Electronics Forum | Thu Nov 08 08:44:22 EST 2007 | aj

Hi, I have just taken a look at the Connector Images. Is there a difference in pitch between both connectors ? From the photo it looks like the Annular Rings are oversized on Image #1 especially around the centre area ( this might be the image ).

Calculating Solder Volume

Electronics Forum | Thu Nov 08 08:41:15 EST 2007 | mattkehoe

Wow, that is a lot of info so early in the morning. What we are attempting is way less complicated than all that. 1 surface mount footprint, printed and reflowed without a component. Just a fused solder deposit on each pad. All pads the same size

BGA soldering

Electronics Forum | Tue Dec 18 08:08:09 EST 2007 | itwasbill

Hi all, How can I convince my equipment purchasing supervisors that to properly solder BGA's a 7 zone oven would be far superior than a four zone? We currently own a 4 zone oven and I'm fearful that the BGA will not get adequate heat for solder

MPM AP27 motherboard

Electronics Forum | Tue Apr 08 08:57:04 EDT 2008 | toddl

We had a similar issue with a UP2000. We had motherboard problems and needed a new one. Our original board had a 33Mhz CPU but none were available, Speedline told us we needed to buy the upgrade. One of their techs told me that they had a 66Mhz mothe

CP6-4000 nozzle centering errors?

Electronics Forum | Fri May 30 08:24:08 EDT 2008 | cyber_wolf

The nozzles get centered at zero degrees and 180 degrees. I believe the yellow asterisk is the measurement at zero degrees, when it rotates to 180 is when you will get a red X or a green O. (In other words the yellow asterisk is normal) I think you

AOI false fail PPM

Electronics Forum | Fri Aug 08 13:21:14 EDT 2008 | RobP

With AOI it really depends on what you are testing. Not only what criteria, but what different types of components. We run a high volume low mix application for automotive checking for presense, positional accuracy, and all solder joints. We curre

ive solder profiles

Electronics Forum | Tue Aug 12 13:40:08 EDT 2008 | ck_the_flip

GR@ICS: Are you drag soldering or point-to-point soldering? Keep in mind. Drag soldering mimics wave soldering. Molten solder is contacting and dragging across the solder mask. Keep in mind, too, that "semi-matt" or "semi-gloss" will also tend to

Juki 740 troubleshooting - Component Standing

Electronics Forum | Fri Aug 08 02:24:04 EDT 2008 | jti

Hi, You were right on the money, the day after I posted, I recalibrated the LASER height .020 off on LA head, .01 off on LAIC, running perfect now. Secondary issue is a flicker on the monitor, the grid stays up after teaching XY coordinates, someti

Is the demand for in-circuit testing still high for PCBA?

Electronics Forum | Thu Aug 21 08:59:05 EDT 2008 | rway

I would say yes. I don't believe that ICT will every be replaced by boundary scan. Now on some assemblies, boundary scan is viable and certainly a better choice considering test access constraints. But ICT still will play a vital roll in the futur

solder paste volume

Electronics Forum | Fri Aug 08 07:27:43 EDT 2008 | lonta96

Hi, I'm from a semiconductor package assembly, and currently looking for an offline solder paste inspector capable of true volume measurement. Any recommendation for a machine that can measure paste volume on a leadframe (metal substrate)? I found


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