Electronics Forum | Tue Jul 25 08:34:30 EDT 2006 | GS
Does your board passes also through the wave solder step ? If, yes, it could be a matter of secondary reflow on BGA ball solder joints. Best Regards....GS
Electronics Forum | Tue Jul 25 08:46:50 EDT 2006 | GS
Hello all, I need to learn about Conductive Anodic Filament (CAF). All information about the phenomenon will be appreciated. About IPC TM-650 6-2-25 CAF Resistance Test, where could it be performed in European Lab ? Thanks in advance Regards....
Electronics Forum | Sun Jul 30 22:17:08 EDT 2006 | slthomas
We think you hit the nail on the head. FWIW, I haven't heard back from them when I brought this up. I suspect it's going up the ladder. Not necessarily a good sign, but sumpin's brewin'.
Electronics Forum | Thu Jul 27 08:03:18 EDT 2006 | Chunks
Hi H.K.H. OK, I'll step on this one to see what happens... What exactly is the defect? You state this SMT spring acts as a conductor between an R and C. You also state it acts as a housing shock absorber too? Just trying to understand your quest
Electronics Forum | Fri Jul 28 08:28:14 EDT 2006 | davef
Solder paste mixer * Malcom [malcomtech.com] SPS is a non contaminating mixer which utilizes pseudo planetary motion * Japan UNIX [japanunix.co.jp] Uni-Cyclone UM-103 * Genitec [genitec.com] GAM60 * Synergy Engineering [synergymark.com] Unity 500
Electronics Forum | Fri Jul 28 08:44:43 EDT 2006 | russ
I might suggest a few books first roger, then a tour through a few Fab shops. Very aggressive and admirable goal to go from nothing to 16 layer Mfg. Many old established shops still can't even do that!!!!! Russ
Electronics Forum | Tue Aug 01 18:12:18 EDT 2006 | SWAG
Check to make sure the platen and the camera are meeting the sensors that tell the machine they are "parked". Find these sensors and flag them. Look for indication they are working in the input screen. Also, make sure the sensor flags can go into
Electronics Forum | Fri Jul 28 08:46:36 EDT 2006 | davef
Two lines of thought are: * That you have some solder connections points us towards components. It seems like the solderability protection on some components need to have the reflothermal recipe tailored for that component. * Paste selection is a BI
Electronics Forum | Fri Jul 28 08:51:50 EDT 2006 | russ
Are all these defects related to the trace that enters pad? Looking at #2, the good fillet has side trace entry and the bad has front entry. I would suggest that a profile check is in order, then the paste would be next culprit. Russ
Electronics Forum | Sat Jul 29 08:52:09 EDT 2006 | davef
This recipe is nice for leaded soldering. The time above liquidous plus 20*C is too short for mixed alloy soldering. Remember all that nonleaded stuff that you add to the solder acts to increase the liquidous temperature of the alloy. Try slowing
