Electronics Forum | Fri Oct 27 08:53:25 EDT 2006 | russ
I thjink you should bake these parts for 24 hours at 125C I used to have this problem and I even think it was the same package to be honest. Since we started baking all BGAs for rework process regardless of "condition of storage" we have increased
Electronics Forum | Mon Oct 30 21:43:08 EST 2006 | davef
So, after the repair of a BGA, you notice white reside on a nearby connector. Correct? [Sorry we're so dense. Long day.] Tell us about: * Flux class used in repair * Flux class used in original assembly Why are you baking the assembly after repair
Electronics Forum | Wed Nov 08 19:49:41 EST 2006 | davef
Dr. Brian Toleno wrote that section of the posting that I pasted onto the forum. Try: * �Lead-free Soldering Backward Compatibility�, Pan, et al., IPC/JEDEC Pb-free Conference, San Jose, 2006 * Checking with http://www.ipc.org * Contacting Jianbia
Electronics Forum | Tue Nov 07 15:08:59 EST 2006 | russ
here are my thoughts on kester, I have rec'd a sample to qualify here and we cannot even get it out of the cartridge it is so dryed out. Rep informed me that Kester has a problem with its chemistry right now. Product is Mfgr'd in off shore location
Electronics Forum | Wed Nov 08 05:33:44 EST 2006 | amigo
Hello EveryBUDDY ! Sorry if my questions sounds too naive!!!! I am into Mobile phone repairs and have not been hearing much about "LEADFREE" soldering till now. Browsing thro' this forum and various SMTNET newsletters, i find that this is one of the
Electronics Forum | Tue Nov 14 08:17:09 EST 2006 | Rob
Degassing - the air in the void above the electrolyte expands, or in some cases the electrolyte vapourises, blowing the top of the cap from the base. Sometimes electrolyte can also leak out around the base seal. This is also a failure as the cap wo
Electronics Forum | Thu Nov 16 10:51:08 EST 2006 | dman97
Does anyone know if it is possible to upgrade the sigmapro software on these machines to a newer version? We are running version 6.35.19 and it just really sucks. Is it possible to go up to say version 7 without upgrading any hardware on the machine?
Electronics Forum | Fri Nov 17 08:04:24 EST 2006 | jdumont
Morning all. I was wondering if there is a packaging standard (other than 033B) that we can put on our POs to vendors. We are seeing a lot of MSD components come in packaged incorrectly and do not have the man power to bake everything before it goes
Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef
There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear
Electronics Forum | Thu Dec 07 21:08:48 EST 2006 | Cmiller
it is not that I am aware of either. Make sure you get your boards from a house that does the gold plating in-house or you will continue to have the problem. The gold needs to be plated immediatly after the nickel, not a few days later. I have only h
