Electronics Forum | Thu Sep 01 02:47:01 EDT 2005 | stalkerb
Thanks Cmiller & PR, I am warmed to hear others are doing this sort of thing.......like all inovative ideas, you often stumble into them. As far as im aware the ERSA dual Pot is the only machine avaiable on the market that can do this sort of thing
Electronics Forum | Thu Sep 01 00:52:24 EDT 2005 | adlsmt
Depending on the connector you should be able to use a standard cheap arbor press with some cheap home-made tooling. Standard arbor presses typically have a rotating disc with cut-outs, remove this and put a decent quality stainless steel block in it
Electronics Forum | Thu Sep 01 08:15:51 EDT 2005 | jdengler
The 1CA0A009 would lead me to believe that the PD's may not be as accurate as possible. If the PD is bad then every location that uses that PD will have about the same error rate. The 12040403 would lead me to believe the feeders are haveing trouble.
Electronics Forum | Fri Sep 02 05:10:21 EDT 2005 | pyramus
Hi I just would like to ask some assistance how to convert a line using a leaded process to a lead-free process? Is there a need for us to change any equipment? printer/reflow? Currently, we are not yet in full 100% lead-free process yet so most lik
Electronics Forum | Tue Sep 06 10:20:33 EDT 2005 | slthomas
I love these stories. At my previous employer we experienced intermittent failures on an audio microprocessor assembly being used on a *new* product. This board had numerous microprocessors and complex firmware aboard. They discovered one PLCC on
Electronics Forum | Wed Sep 07 10:41:24 EDT 2005 | D.B. Cooper
We've seen the same thing - leads of QFPs not as strong as we'd like them to be. In the past 4 years no problem, this Spring they start failing. Touch a solder iron to it and it solders fine. After crunching some data, we found that both QFPs fail
Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef
Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin
Electronics Forum | Mon Sep 05 01:38:12 EDT 2005 | plcc
I hv a PCB (mtrl is RF35). After going thru' reflow, we found yellowish stain on the solder pad (solder mask). It looks like burn-marks. The reflow temp use is 245oC. We tried running bare pcb under 220oC, there's minimum stain found (acceptable),how
Electronics Forum | Wed Sep 07 04:28:26 EDT 2005 | Slaine
were looking at paste, wire, preforms and solder bars (for solder pots), concentraiting on HMP, sn62,96S, and 2 different sac alloys, we also have 7 different fluxes and 16 temination inks (which were also having to change for RoHS because the ink co
Electronics Forum | Thu Sep 08 01:58:08 EDT 2005 | darby
0. Any less and you are scooping the paste from the aperture with the squeegee blades. I'm not saying that either of these situations is a good or a bad thing, it's just that if you buy a 6 mil stencil, you are trying to achieve 6 mil paste height.
.gif)
