Electronics Forum: /09 (Page 1446 of 1632)

SMT placement machines. Where are we going ?

Electronics Forum | Tue May 19 09:40:33 EDT 2009 | cyber_wolf

Subject: What placement platform/manufacturer will dominate the future of sub-contract? or OEM for that matter. I have worked multiple placement platforms over the last 20 years. I have worked with Dynapert,Celmacs,Fuji and contact systems to name a

SMT placement machines. Where are we going ?

Electronics Forum | Mon Jun 01 09:03:18 EDT 2009 | sys_steven

This is a most INTERESTING thread! Every Pick and Place machine has its plus side and negative. Having worked on both sides, broker/service and production, I think I have a unique perspective on this. Over the years our market has changed to be mo

Conformal Coating Equipment - Where to Start?

Electronics Forum | Tue Jun 09 23:00:53 EDT 2009 | davef

Suppliers are: * Asymtek; 2762 Loker Ave West, Carlsbad, CA 92010; 800-279-6835 760-431-1919 F760-431-2678 asymtek.com * Ultrasonic Systems; 135 Ward Hill Ave, Haverhill, MA 01835; 978-521-0095 F978-521-7023 ultraspray.com sales@ultraspray.com Stepha

BGA Pad Cratering

Electronics Forum | Sun Jun 07 09:01:47 EDT 2009 | davef

IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as

Crazing or Delam - Thermal or Mechanical?

Electronics Forum | Wed Jun 17 16:02:09 EDT 2009 | mhunter

Any thoughts on this will be appreciated, thanks in advance for reviewing. This assembly has been processed in our facility by going through a press operation (~ 1731 lbs), then into wave solder. Note the discoloration around the pemnut. The discol

Flux residue

Electronics Forum | Fri Jul 31 09:12:35 EDT 2009 | gregoryyork

Dear Sean Contrary to believe MOST formulators of No Clean fluxes or No Residue fluxes use organic acides that are in fact weak and benign. IF the residue was left on the board and you had a condensing atmosphere then you may see some issue with fal

MPM UP2000 HiE Z problem

Electronics Forum | Fri Aug 07 09:53:12 EDT 2009 | kpm135

The Z-axis Drive card on our MPM UP2000 HiE fried. We replaced it with a new card, setting all the jumpers to match the old card. After that we had to recalibrate the Z-axis and the snugger height but the problem is that the camera is now too close t

Minimum Tg for LeadFree board.

Electronics Forum | Fri Aug 21 00:27:09 EDT 2009 | boardhouse

Hi To Start Min Tg is just a portion of picking a lead free material, the other is Td. We recommend the following to our Customers. 2-8 layer 150 Tg. Min. / 340 Td. 8-Up. 170-180 Tg.Min. / 340 Td. The above recommendations have been used by man

Low Silver Solder Problems

Electronics Forum | Sun Aug 23 07:03:09 EDT 2009 | ghepo

OK Eric, is difficult answer at distance without examine the PCB..., anyway in my opinion the problem is the PCB quality. There are two possibility : the crack is between solder and nickel or is between nickel and pad copper. In both situation the

Mysterious reflow problem

Electronics Forum | Wed Sep 23 03:43:31 EDT 2009 | d0min0

hello, we are profiling with the pcb each day - results are very good with a small delta we made another test board with TC only in the problem places - same good result we tried 500-600 boards on 12 zone machine - zero defects while on standard 6


/09 searches for Companies, Equipment, Machines, Suppliers & Information