Electronics Forum | Thu Sep 27 19:52:28 EDT 2001 | davef
All of the discussion of "environmental controls" are a matter of degree, dependent on the requirements of the product that you manufacture. For example: shops assembling under-the-hood products have different requirements than shops making garage d
Electronics Forum | Wed Oct 03 09:26:19 EDT 2001 | davef
Whether the customer is from a large or small corporation, military or commercial, the majority of our data comes in RS274X. In theory, ODB++ seems like a good idea. It may take some time for it to actually get into the mainstream where we are. It
Electronics Forum | Tue Oct 09 12:23:07 EDT 2001 | Mike Konrad
Hi Danial, Yes, you can use one cleaning chemistry for all paste types. There are many available chemistries from many manufacturers. The chemistries that I would recommend include: StencilWash Plus from Aqueous Technologies http://www.aqueouste
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
Electronics Forum | Wed Oct 24 18:09:44 EDT 2001 | davef
Allowing the board fabricator to define the board you expect to receive is fine, as long as they do a good job. Regardless of the existence of a clear product definition or not, it�s reasonable for you to argue that your receipts must meet the requi
Electronics Forum | Fri Nov 09 11:55:49 EST 2001 | mparker
If you are getting solder shorts under a device, how would "hiding" the extra long pad with solder mask help? If the pad can't be seen once the device is in place, it is already "hidden". Getting your customer to redesign the pads may take some time
Electronics Forum | Thu Dec 06 15:09:14 EST 2001 | smtspecialist
Thanks for the info, Of course the first thing to do was to look with my supplier, but the problem was that it's a special relay, custom made from a design created 10 years ago. Two years ago that company went BK and we had to order a whole bunch t
Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia
Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But
Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia
Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of
Electronics Forum | Thu Feb 07 09:07:10 EST 2002 | fmonette
Dason, Please be aware that weight gain is only a very crude estimate of the component moisture content. This is only accurate when the moisture is uniformly distributed inside the component (which is actually never). This measurement is usually no
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