Electronics Forum: /09 (Page 281 of 1632)

BGA void removal

Electronics Forum | Mon Sep 30 09:00:26 EDT 2002 | arcandspark

Russ, I have been reworking BGA's for over five years now and have never been able to remove voids in the solder balls without removing the BGA itself. Your thermal profile can also cause the voids along with a poor solder paste. I have experimented

Current Amplifiers!!! How to???

Electronics Forum | Mon Sep 30 09:47:37 EDT 2002 | Zoran

Hi, I was wondering whether anyone could explain to me, point me in the right direction or send me a schematic on how to build Current Amplifiers. I am building a automated temperature controlled cooling unit and I need to build a current amplifier

SRT BGA Machine

Electronics Forum | Wed Oct 09 17:50:09 EDT 2002 | alj

Wrong..! It is a money loser for Teradyne and it will be cut in the future. Wow, auto thermal profiling.. Gee, that is a little late. When will the summit platform be redesigned. It's the same thing they sold 10 years ago with a few modificati

Standard for BGA void

Electronics Forum | Mon Oct 21 08:46:15 EDT 2002 | davef

60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09% II. Missing Ball: This is prohi

P&P Machine & ESD Protection

Electronics Forum | Mon Jan 20 09:55:09 EST 2003 | Claude_Couture

The carrier tape and cover tape of static sensitive components are either conductive or dissipative. as for the P&P machine, as long as they are made of metal and grounded, static buildup is not an issue. All PCB conveyors I've seen have static condu

IPC Class II and Class III reliability

Electronics Forum | Wed Apr 09 14:09:54 EDT 2003 | davef

MA/NY DDave, I'll take your money. I'm betting on the Class II, whatever that is, because: * Solder is the same. * Board is the same from a fabrication and probably materials standpoint. * Components are the same. * Processing is the same. ... but

Wire bonding on gold fingers

Electronics Forum | Wed Jun 25 09:42:09 EDT 2003 | caldon

SR. Here is a shot in the dark but have you try'd KNS? I know they have been working on some cool polymers...send them a note as they may have something that meets your needs. They may not have anything that can be removed but it is worth a try. pol

Manufacturing breakthroughs?

Electronics Forum | Tue Sep 09 00:51:33 EDT 2003 | iman

everyone made good observations in the arena of improvements. being rather pessimistic today, I'd like to say the one core area of little (if none at all) improvement is the over-reliance of human (aid/non-aid) inspection of SMT output soldering de

OMNIFLOW 10

Electronics Forum | Sat Sep 06 21:50:09 EDT 2003 | Hoss

Sr. Assuming you are processing the garden variety 63/37 paste on FR4 substrates, a good starting point is to plan for 3.5 to 4.5 minutes of process time on the board. If you measure the total heated length of your oven and you use the range above,

solderability and hasl thickness

Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef

We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b


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