Electronics Forum | Mon Jul 10 09:25:47 EDT 2006 | nodlac
Here is a nugget from the Data Sheet... Wave Soldering: Excess moisture on the PCB during soldering may lead to random solder balling and poor wetting of some solder joints. IT IS IMPORTANT that the flux solvent carrier (water) is fully evaporated a
Electronics Forum | Tue Jul 04 09:38:50 EDT 2006 | Mustang
Thanks for your fast respond Dave & Slaine. It was much appreciated. Dave, I'm not familiar with the ion Chromatograph testing i.e. how different it is versus SIR, but you could be right. May be they have mistaken this. Let me try to search for som
Electronics Forum | Tue Jul 18 09:46:42 EDT 2006 | SWAG
We run humidifiers in our shop because we are usually around 25% RH. We track this with a data-logger and RH device. It's dry here! Sometimes in the summer, it can get between 5 and 10% RH outside = thunderstorms/dry lightning and forest fires. I
Electronics Forum | Thu Jul 20 12:09:18 EDT 2006 | Bill Csonka
John S. Bill Csonka of Photocircuits Inc. here again. Photocircuits does have the latest TS16949/QS9000 cert. that you asked about in your original posting. When I can be of assistance or when you need a quote don't hesitate to call or e mail me
Electronics Forum | Fri Jul 21 09:08:58 EDT 2006 | ahmedrehan
Hi, I want to setup new line for SMT assembly with used equipment. I am new in smt feild Please guide we want to do 10,000 boards / month size is 9X7 inch with 110 smd components. What should i look for in a machine. Thanks. Rehan
Electronics Forum | Fri Jul 28 09:12:59 EDT 2006 | pavel_murtishev
Good afternoon, Profile is standard ramp-soak-spike (According to paste manufacturer requirements), paste is Almit V16L HM1-RMA, type 3, Sn62Ag2. Look here for details: http://www.yousendit.com/transfer.php?action=download&ufid=98684D1201B0F001
Electronics Forum | Fri Jul 28 09:20:10 EDT 2006 | pavel_murtishev
Good afternoon, No, defects aren�t trace related. I�ve just posted reflow profile (reply to Chunks). I suspect the component only. All other components are fine. But I can�t understand what exactly happens with this component. I tried to play with s
Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Tue Aug 01 10:09:52 EDT 2006 | cyber_wolf
Chunks, Make sure your aspect ratio is OK. Normally for an application like this, I would use a .005 foil. The foil material would be invar.The invar has better release characteristics. Crappy solder paste can also cause release issues. I am not sur
Electronics Forum | Tue Aug 08 09:52:13 EDT 2006 | aj
I would be interested to see what Dross eliminators are available also. I am currently trialing a very user friendly Solder Saver Handtool- it basically churns the Dross Solder until the dross is left in Powder form. We then scoop out the powder. e