Electronics Forum | Fri Jun 24 07:02:35 EDT 2005 | davef
Problem 1: Solder shortage * Stencil aperatures [except the heat slug] should be 1:1 with the board. * Stencil should be 5 thou thick laser cut. * Board should be 1:1 with the component * Print should look good. Problem #2: Bad connection between p
Electronics Forum | Tue Jun 26 12:39:08 EDT 2001 | danial
Our mother company shipped to us a lot of old datecode material and upon running them in the line we experienced non-wetting condition, esplly on the 0402 ( not tombstone ) We have run a dip-and-look test but I guess the method is very subjective as
Electronics Forum | Tue Jun 26 19:59:08 EDT 2001 | davef
They always tell you to calculate ROI, when they want to blow you off. Do a net search using - calculate ROI. Links to three pretty good descriptions on this are: http://www.dmreview.com/editorial/dmreview/print_action.cfm?EdID=2487 http://www.eval
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Thu Jun 08 16:12:19 EDT 2017 | davef
Your plater's recommendation should work fine. Your simple copper plate will work, but you'll be stepping into fighting a copper tarnish battle. Silver over the copper is a better choice. I was thinking a silver thickness of a minimum of 3 microns
Electronics Forum | Tue Dec 17 05:58:36 EST 2019 | robl
We had a customer who used XRF to determine the thickness of the "tinned" layer of components - sort of what is briefly mentioned in Bob Klenke's SMTA paper - http://www.circuitinsight.com/pdf/Solderability_Testing_Protocols_Component_Re-Tinning_Me
Electronics Forum | Thu Jul 05 19:39:19 EDT 2001 | davef
I had forgotten that it was you that was on the Sipad adventure. [But then again, who can keep track of yer aliases? ;-)] You just go from one adventure to the next. Expanding On Dave�s Hi-Test Flux Method Theory � PASTE: Yes, contact your favorit
Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe
I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching
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