Electronics Forum: underfil (Page 1 of 26)

BGA underfill necessary with conformal coat?

Electronics Forum | Mon Apr 01 20:33:30 EST 2002 | davef

Regarding your underfil ... * What material did you use as an underfil? * What machine and technique did you use to apply the underfil? * What type of component were you underfilling? * What was the end-use environment?

BGA Underfill Rework

Electronics Forum | Mon Mar 29 14:29:50 EST 2004 | davef

Few people underfill PBGA. People underfill CCGA, uBGA, and FC. Consider a reworkable underfill on those devices that you expect to rework. Reworkable underfill candidates * Thermoset: ME526 (Red) * Loctite: 3567 (Cream) * Dexter: FP 4511 (Black)

Underfill

Electronics Forum | Fri Apr 25 12:36:52 EDT 2008 | fsw

All, Does anyone on the forum have experience with underfill? We have a component with QFN pkg on one of the new products. It has a thermal pad in the centre. Customer wants this component to have an underfill. Questions - 1) Does one normally req

Underfill 300balls BGA connector

Electronics Forum | Thu Sep 04 03:27:52 EDT 2008 | akareti

All, Does anyone have experience with underfill 300balls BGA connector? We have a component with 300balls BGA connector that connectorize with Flex. Customer wants to have an underfill Questions - Possibility for underfill 300balls BGA connector -

No Clean and Underfill

Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo

No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux

FP4531 underfill rework

Electronics Forum | Tue Jul 26 08:57:23 EDT 2011 | indyc

I am trying to rework FP4531 underfill. Some of the underfill flowed to adjacent capacitor and resistor. Even though the datasheet says that it is non-reworkable, has anyone tried reworking / removing excess underfill? Any information would be help

Underfill

Electronics Forum | Fri Sep 25 09:51:53 EDT 2020 | majdi4

I didn't understand your request.. Are you talking about underfill process (dispensing) or underfill with tape and reel packaging?? does the component drops at the 2nd reflow? that's why you want to go ahead for underfill process?? Thank you .

Underfill 300balls BGA connector

Electronics Forum | Fri Sep 05 12:15:34 EDT 2008 | evtimov

All, Does anyone have experience with underfill > 300balls BGA connector? We have a component with > 300balls BGA connector that connectorize with > Flex. Customer wants to have an > underfill > > Questions - Possibility for > underfill 300ba

CSP and underfill

Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C

No Clean and Underfill

Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef

Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.

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