Industry Directory: .0,2 (7)

TaiMoon Electronics LTD.

Industry Directory |

We manufacture multi PCB up to 12 layer,The details of our capabilities:*Micro fine line to 4 mil *Blind & buried via hole *Flying-probe testing *Carbonlack *FR4 thickness: 0.3/0.4/0.8/1.0/1.2/1.5/2.0/2.4/3.2mm *Small quantities are available *Golden finger *HAL & chemical tin

New SMT Equipment: .0,2 (4591)

MALCOM STA-2 Solder Impurity Tester

MALCOM STA-2 Solder Impurity Tester

New Equipment | Solder Materials

Soldering is now lead-free. Reflow soldering quality with solder paste can be maintained by controlling the furnace temperature or determining the temperature profile on condition that the solder paste material is decided and the materials, surface t

Seika Machinery, Inc.

Hioki: FA1240 Flying Probe Tester

Hioki: FA1240 Flying Probe Tester

New Equipment | Test Equipment

Ultra-High speed measuring Measuring rate up to 40 steps per second helps reduce tact times and can actually be used in fully automated production lines averting a bottleneck. This is indeed a unique strength of Hioki’s flying probe testers. Fine pi

Seika Machinery, Inc.

Electronics Forum: .0,2 (136)

Flux dip or solder print for CSP

Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob

80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.

Backward compatibility in LF solder pot

Electronics Forum | Mon Jul 25 17:24:25 EDT 2005 | Kris

0.2% lead will make your solder non compliant with RoHS when you move to a completely RoHS compliant BOM. Check with your bar vendor how much it will take to convert a pot containing 0.2% lead to

Used SMT Equipment: .0,2 (129)

Assembleon AX-501 SMT Placement

Assembleon AX-501 SMT Placement

Used SMT Equipment | Pick and Place/Feeders

1.00: 35 micron for chips & 25 micron for QFP   Component range - minimum: 0.4 x 0.2 mm (01005) to - maximum: 45 x 45 mm Maximum component height: 10.5 mm (0.41”) [optional: 12 mm (0.47”) ] Automatic toolbit exchan

Capital Equipment Exchange

Universal Instruments GSM1 *upgraded* SMT Placement

Universal Instruments GSM1 *upgraded* SMT Placement

Used SMT Equipment | Pick and Place/Feeders

UPS+6 - windows software PTF (platform tray feeder) for matrix tray components - with pre-orient NPI Software - New Product Introduction s/w for quick set-up and minimal scrap Updated VME! Vision ESI-650H card, EPC-16 Magellan megapix

Capital Equipment Exchange

Industry News: .0,2 (119)

Europlacer to Debut iineo-II Placement System at APEX 2008

Industry News | 2008-03-04 12:05:25.0

APEX, NC - January 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new iineo-II SMT platform in booth 1624 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, in Las Vegas.

EUROPLACER

Europlacer to Display iineo-II Placement System at IPC Midwest 2008

Industry News | 2008-09-14 15:09:42.0

APEX, NC - September 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will showcase its iineo-II SMT platform in booth 423 at the upcoming IPC Midwest Conference & Exhibition that is scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.

EUROPLACER

Parts & Supplies: .0,2 (809)

Technical Library: .0,2 (223)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Fluid Flow Mechanics Key To Low Standoff Cleaning

Technical Library | 2009-09-18 14:42:37.0

In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil.

ZESTRON Americas

Videos: .0,2 (113)

Universal GSM1 with FlexJet customer acceptance.

Universal GSM1 with FlexJet customer acceptance.

Videos

Universal GSM1 with FlexJet customer acceptance.

Capital Equipment Exchange

Hioki Demo

Hioki Demo

Videos

Ultra-High speed measuring Measuring rate up to 40 steps per second helps reduce tact times and can actually be used in fully automated production lines averting a bottleneck. This is indeed a unique strength of Hioki’s flying probe testers. Fine pi

Seika Machinery, Inc.

Career Center - Resumes: .0,2 (2)

resume

Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing

• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.

Glenn Brown for 3070 ICT Development

Career Center | Appleton, Wisconsin USA | Engineering,Production,Research and Development,Technical Support

I have more than 25 years of experience in electronics manufacturing and printed circuit board (PCB) structural test. My forte is in-circuit test (ICT) program and fixture development and debug on the HP/Agilent 3070. I have more than 16 years of 3

Express Newsletter: .0,2 (5)

Partner Websites: .0,2 (31)

Toner

Clariant Cargo & Device Protection | https://www.clariant.com/de/Business-Units/Pigments/Non-Impact-Printing/Toner

. Mehr Novoperm Yellow P-HG Novoperm Yellow P-HG is a green shade benzimidazolone pigment of the P-grade range with extremely low specific conductivity (< 0,2 mS/cm

Clariant Cargo & Device Protection

Letterhead

Metcal | http://www.okinternational.com/File%20Library/Metcal/Resources/Catalog/2018/Metcal_CV-Cartridges-Catalogue_2018_GER.pdf

UFC-7CN5102S (ø x L) 0,2 x 5,1 mm http://www.okinternational.com/ http://www.metcal.com/ www.okinternational.com -- www.metcal.com Seite 13 Konische Lötpatronen Ultra-Fein UFC-6CN5502R UFC-7CN5502R 30° gebogen, für Arbeiten unter dem Mikroskop, (ø x L

Metcal


.0,2 searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next