Electronics Forum: .0-2 (Page 1 of 15)

Flux dip or solder print for CSP

Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob

80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.

Backward compatibility in LF solder pot

Electronics Forum | Mon Jul 25 17:24:25 EDT 2005 | Kris

0.2% lead will make your solder non compliant with RoHS when you move to a completely RoHS compliant BOM. Check with your bar vendor how much it will take to convert a pot containing 0.2% lead to

Problems encountered in mounting 01005 components on 0.2mm PCB

Electronics Forum | Fri Oct 03 01:01:09 EDT 2008 | khushi

Dear All, I would like to know that what are the problems which will be encountered while mounting 01005 components & BGA's on the PCB for thickness 0.2mm and what will be the processes involved in mounting the components.

Temperature Profile for 0.2mm Thick ENIG Flex PCB

Electronics Forum | Thu Jan 30 10:12:00 EST 2020 | emeto

More detail Jinesh. Profile, datasheet of the part, stencil design, PCB finish, soldering material. Initially I am assuming you use pallet to reflow 0.2mm thick board.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon

Maybe something like this could work?

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

Reject Rate

Electronics Forum | Mon Nov 09 15:52:42 EST 2009 | sawyer

Hi, as i know the reject rate it should be under 0,2%.

solder ball

Electronics Forum | Tue Dec 31 02:13:14 EST 2019 | agoesfirmanto

This PCB model has been in production since 2018 and stopped production almost 1 year ago, now it has started production again and I found this problem. at the time of production in 2018 this problem did not occur. while the parameter settings do not

LED sticking into carrier tape

Electronics Forum | Tue Aug 01 11:23:56 EDT 2017 | OrHorti

We are using a custom made nozzle, designed for this particular LED. The dome of the LED is also custom made, the diameter of the lens at the base is 2.9mm while the substrate of the package is 3.3mm, so this gives about 0.2mm spacing between lens a

Temperature Profile for 0.2mm Thick ENIG Flex PCB

Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr

Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-

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