Electronics Forum: .35mm (Page 1 of 7)

LGA36 6.5 x 3.5 mm

Electronics Forum | Fri Apr 06 16:36:39 EDT 2007 | mika

Ah, I almost forget (forgot?) to mention that according to the Gerber files (which is the info we send to the PCB-house) the PCB land pattern for this LGA-36 0.35mm rounded pads and the boardhouse cannot achieve this. I understand them; 0.35mm pads,

automatic insertion of radial components 3.5mm

Electronics Forum | Mon Aug 20 05:53:26 EDT 2007 | erhard

Hello all, we are about to modify a Universal Radial 5 so the machine will be able to insert radial components with lead pitch 3.5mm and 5mm. The 3.5mm components are ELCOs which are getting inserted all the way to the component body so they sit fi

LGA36 6.5 x 3.5 mm

Electronics Forum | mika |

Sat Mar 24 06:12:28 EDT 2007

automatic insertion of radial components 3.5mm

Electronics Forum | Mon Aug 20 15:53:52 EDT 2007 | erhard

Manufacturing already tried to get a design change but no chance. I guess because the designer is afraid the components could get bent too much if they are mounted with a stand off. Of course everyone who has to manufacture this fist sais: why don't

Is IPC-9701 apply to QFN package?

Electronics Forum | Sun May 24 21:12:59 EDT 2009 | keith78

I have a problem recently to qualify QFN package on solder joint reliability. The pcb thickness stated in IPC-9701 is 2.35mm but from the in-house test, QFN surface mount on 2.35mm thickness PCB board have a short cycle to failure due to higher CTE m

Modify radial machine pitch from 2.5 to 3.5 pitch

Electronics Forum | Sun Jun 16 08:00:51 EDT 2013 | zaldytorres

Does anyone have suggestion how to modify radial insertion machine to 3.5mm pitch? I have to insert 3.5mm pitch Ecap but the industry standard radial machine could mount only 2.5 or 5 mm pitch. changing PCB or parts is not an option as it is not appr

Double sided BGAs

Electronics Forum | Thu Jun 23 08:58:00 EDT 2005 | Irene Taylor

We are defining a new assembly process for a double sided card that has 26 BGAs on the top side and 14 BGAs on the bottom side. We currently have one double sided BGA board with one BGA per side and have to epoxy one BGA (35mm X 35mm - 352 ball count

Video Recording for Reflow

Electronics Forum | Thu Aug 27 09:18:57 EDT 2015 | fcmtechnician

Hi Don't know your reflow brand, but try to decrease the blower speed...is possible that air blow out the componets! For vibration, chain related issue, etc open your hood and start the oven in colder recipe with pcb inside! ( put the service key o

LGA Processing

Electronics Forum | Fri Mar 30 23:35:43 EDT 2007 | mika

Question: Does this formula apply even for the small LGA:s like LGA36 6.5 x 3.5 x 0.6 mm pad size 0.35mm pitch 0.60mm? We use a 0.13 mm stencil thichess beacuse on the same board there is some P.I.P comps. The board dimensions is 35 x 50 mm on a pane

LGA36 6.5 x 3.5 mm

Electronics Forum | Sat Mar 24 19:49:29 EDT 2007 | mika

Aj, Many Thanks and I will of course share our experience about this. /Mika

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