Electronics Forum | Tue Feb 16 13:58:02 EST 2016 | tsvetan
this document http://www.latticesemi.com/view_document?document_id=671 may be good start point but note that how to escape from the BGA is not big deal, how to route your filtering capcitors, grounding, impedance control lof you high speed signals ar
Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Tue May 08 21:13:04 EDT 2001 | Paul
My company is a low-volume high mix contact electronic manufacturer. We are currently looking at purchasing a pick and place machine that is capable of mounting such new components as microBGA's and other CSP's at such ball pitches as 0.5mm for examp
Electronics Forum | Mon Jul 15 17:35:42 EDT 2002 | davef
Micro BGA � (�BGA�). A Tessera brand name for a fine [0.5 mm and 0.75 mm solder ball] pitch BGA.
Electronics Forum | Mon Jul 15 09:41:11 EDT 2002 | soupatech
I am experimenting with 2 types, FG256 17x17mm and FG456 23x23mm both with a 1mm pitch and .5mm ball. They both have a full array. As for as the x-ray, we are looking into pruchasing some used equipment but will mostly send them out for testing until
Electronics Forum | Thu Jul 18 17:41:31 EDT 2019 | rgduval
The UFP was a designation for "ultra-fine-pitch"; but, for the most part, you should be able to get the same placements out of both machines. Anything 0402 or above can be mechanically centered. The UFP machine will lean on optical centering for .5
Electronics Forum | Tue Aug 22 03:04:07 EDT 2006 | PP
Any help/suggestion is much appreciated I am doing lots of BGA Reworks from a small uBGA with a few balls to a large BGA with over 1500 balls. The reworks have been done on SRT 1100 Series Machine for many years. SRT 1100 Machine is good for the c
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Fri Jun 18 11:31:17 EDT 2004 | gregp
I think it depends on the thickness of the PORON sheet. For .3mm balls you could probably get away with a pretty thin sheet (maybe 1/16"). I don't know how thin it comes offhand. For the part you are describing I woulf try maybe a 3.5mm OD and a 1
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