Electronics Forum: 0

0402 stencil design

Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef

You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas


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