Electronics Forum: 0

PDBE and PBB replacements???

Electronics Forum | Fri Mar 11 18:30:50 EST 2005 | davef

Russ: In December 2003, the European Commission released the following statement: �The commission services have prepared a draft Commission decision establishing maximum concentration values pursuant to Article5(1)(a) of Directive 2002/95/EC. The pr

Inventory control and maintenance

Electronics Forum | Thu Feb 26 14:47:19 EST 2015 | superlen

unique mnf/mnf part number. - Be meticulous on maintaining your WO Boms. Train your employees to not circumnavigate keeping the WOBOM accurate to what they kitted/placed on the board. If you keep the one to one part number relationship above this is

Fuji CP6 and IP3 specifications request

Electronics Forum | Fri Aug 05 08:15:39 EDT 2016 | jdengler

The IP3 specs are: PCB Dimensions Max: 508 mm x 457 mm - Min: 80mm x 50mm Thickness: 0.8 to 4.0mm Component Capacity Tape: 74 - 8/12mm Device Locations Tray: 40 Locations Placing Rate: 0.55 sec/component for small chips 1.25 sec/component for ICs

Fuji CP6 and IP3 specifications request

Electronics Forum | Tue Aug 09 11:14:28 EDT 2016 | cyber_wolf

•Rated Speed of 40,000 CPH •140 - 8mm Device Locations •14" x 18" Max PCB Size PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm Board Thickness: 0.3 to 4.0mm Component capacity Up to 140 types (8mm tape) Placing rate 0.09 sec./component - 40,

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

Leaded and Lead-Free products in single SMT line

Electronics Forum | Tue Sep 13 01:52:53 EDT 2011 | SheanDalton

My recollection is that RoHS limits for lead is 0.1% of the weight of any homogeneous material in the assembly.

Re: wave soldering surface mount tantalum and ceramic capacitors

Electronics Forum | Fri Feb 05 09:39:58 EST 1999 | Dave F

| Can anyone help me with the pros and cons of trying to wave | solder tantalum and large (1812) ceramic capacitors. I do | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what proble

Re: wave soldering surface mount tantalum and ceramic capacitors

Electronics Forum | Tue Feb 16 16:28:30 EST 1999 | Tuffty

| | Can anyone help me with the pros and cons of trying to wave | | solder tantalum and large (1812) ceramic capacitors. I do | | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 19:07:22 EDT 2021 | llawrence

That is all a lot to take in, but thank you all for the recommendations. From what I understand, I'm going to start by ordering a new polished 0.1mm stencil with size reduced apertures and seeing if reduced paste deposit will help. As for the sten

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 09:38:36 EDT 2021 | spoiltforchoice

Well everything Graham said with some additional points.. You mention manual printing but very little about your stencil or setup. Everything you have said indicates a very limited budget has been expended, however what you have is an extreme exampl

  1 2 Next

0,01 and foorprint searches for Companies, Equipment, Machines, Suppliers & Information