Electronics Forum: 0

Flux dip or solder print for CSP

Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob

80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.

Screen cleaner evaluation

Electronics Forum | Mon Feb 04 12:28:28 EST 2008 | jseagle

1.0mm (0.039") 1.75X >0.5 to 1.0mm (0.02 to 0.039") 4X 0.25 to 0.5mm (0.00984 to 0.02") 10X

Backward compatibility in LF solder pot

Electronics Forum | Mon Jul 25 17:24:25 EDT 2005 | Kris

0.2% lead will make your solder non compliant with RoHS when you move to a completely RoHS compliant BOM. Check with your bar vendor how much it will take to convert a pot containing 0.2% lead to

Problems encountered in mounting 01005 components on 0.2mm PCB

Electronics Forum | Fri Oct 03 01:01:09 EDT 2008 | khushi

Dear All, I would like to know that what are the problems which will be encountered while mounting 01005 components & BGA's on the PCB for thickness 0.2mm and what will be the processes involved in mounting the components.

Temperature Profile for 0.2mm Thick ENIG Flex PCB

Electronics Forum | Thu Jan 30 10:12:00 EST 2020 | emeto

More detail Jinesh. Profile, datasheet of the part, stencil design, PCB finish, soldering material. Initially I am assuming you use pallet to reflow 0.2mm thick board.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon

Maybe something like this could work?

solder ball

Electronics Forum | Tue Dec 31 02:13:14 EST 2019 | agoesfirmanto

This PCB model has been in production since 2018 and stopped production almost 1 year ago, now it has started production again and I found this problem. at the time of production in 2018 this problem did not occur. while the parameter settings do not

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

Reject Rate

Electronics Forum | Mon Nov 09 15:52:42 EST 2009 | sawyer

Hi, as i know the reject rate it should be under 0,2%.

Wave soldering SMT component spacing

Electronics Forum | Thu Aug 29 20:34:02 EDT 2002 | ppwlee

A gap of 150-200� between potential shadow components is enough to eliminate those problems. Dave, Can you clarify? Do you mean 0.015 to 0.02?? Peter

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