Electronics Forum: 0

RoHS 1/7/2006 (EU)

Electronics Forum | Wed Sep 22 13:56:24 EDT 2004 | GS

Hello everybody, are this the values still required by RoHS or there have been some modification ? - Maximum concentration Lead (Pb) 0,1 weight% - value of heavy metals Mercury 0,1 weight% - Cadmium 0,01 weight% - Chromium VI 0,1 weight% - Maximum

Truth Table for and

Electronics Forum | Mon May 23 11:37:36 EDT 2005 | dougt

AND A B C -------- 0 0 0 1 0 0 0 1 0 1 1 1 C is the result Are you studying for a test?

Truth Table for and

Electronics Forum | Mon May 23 16:38:48 EDT 2005 | thaqalain

0 0 0 0 1 0 1 0 0 1 1 1 Please u check sequence of rows,I think above is correct sequence.

Any comments for Quality @ AQL=0.1, C=0 ???

Electronics Forum | Mon Mar 25 23:11:44 EST 2002 | ianchan

Thank You, Dave F!

Accuracy of placement +/-100um @ 5 sigma

Electronics Forum | Thu Nov 20 12:10:20 EST 2003 | frank

Well, let me take a shot... +/-100um = 0.1mm 5 sigma = is the number of acceptable defects (or placements outside of that accuracy (or tolerance). I believe 5 sigma is 233 defects out of 1 million, but I could be wrong on that. So basically all pl

Why 50 mils in 0805 package instead of 40 mils.

Electronics Forum | Fri Oct 03 09:00:18 EDT 2003 | davef

EIA standard packages have a variety of L/W proportions. EIA Dimension mm (LXW) Proportion (L/W) 0201 0.6X0.3 2 0202 0.5X0.5 1 0303 0.8X0.8 1 0402 1.0X0.5 2 0504 1.25X1.0 1.25 1.4X1.4 1 0603 1.6X0.8 2 0805 2.0X1.25 1.6 1111 2.8X2

Re: COB module design / layout

Electronics Forum | Thu Oct 26 17:48:47 EDT 2000 | Dave F

In response to your questions: 1) Suggestions on substrate material FR-4 or something better? Most PBGA are on BT. That might good for you, also. 2) Are there design guidelines for wire bonding pattern on the substrate? Several things: 1 Doesn�t

PTH Solder Short

Electronics Forum | Mon Apr 04 08:41:09 EDT 2005 | davef

It depends on the component and the land, but 0.1 inch is safe.

Flip Chip

Electronics Forum | Fri Aug 24 09:38:17 EDT 2001 | gerits

Hi, you can use the Assembleon (Philips) ACM Micro for this. It can place Flip Chip form 0,1x0,1mm upto micro BGA, CSP's etc. etc. It even can handle Odd's and insert components. Web-site http://www.assembleon.com Please contcat me or our company o

Lead contamination in wave solder pot...

Electronics Forum | Tue Feb 08 19:10:09 EST 2005 | DasonC

Lead free is not define as NO lead and "a maximum concentration value of 0.1% by weight in homogeneous materials for lead shall be tolerated." Check below link. So replaced your solder from the pot when exceed 0.1%. http://www.leadfree.org/files

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