Electronics Forum | Tue May 02 16:04:44 EDT 2006 | Giovanni Lorenzini L�pez
We are looking for 3 used FIFO buffers in operational conditions model PB-0.6M-9, FOB Puerto Rico. Any informationplease contact Giovanni Lorenzini my e-mail adress is glorenzini@lutron.com
Electronics Forum | Tue May 02 16:05:35 EDT 2006 | Giovanni Lorenzini L�pez
We are looking for 3 used FIFO buffers in operational conditions model CTI Conveyor Technologies PB-0.6M-9, FOB Puerto Rico. Any informationplease contact Giovanni Lorenzini my e-mail adress is glorenzini@lutron.com
Electronics Forum | Tue May 02 16:11:50 EDT 2006 | jdengler
Use the Equipment Mart at left side of this page!
Electronics Forum | Fri Nov 07 01:01:55 EST 2008 | mskler
What should be stencil size to reball the BGA of 0.6MM ball dia.
Electronics Forum | Fri Feb 16 08:28:50 EST 2007 | pavel_murtishev
Good afternoon, Typical plating thickness for immersion tin is 0.6-1.0um. I do not know what the maximal thickness is. But plating is self-limiting process and I believe maximal thickness should be about 2-3um. BR, Pavel
Electronics Forum | Tue Jul 30 03:57:29 EDT 2019 | SMTA-David
Hi, I am looking for software for 2003 model 1707 EXL reflow oven (HC1 controller). I believe latest version for that model is 1.0.6.5.8 (98 Win) or 4.0.2.1 for XP. Thanks
Electronics Forum | Tue Apr 26 05:04:10 EDT 2005 | siverts
Sorry for my blackout, but here it comes: Solder paste: Senju 7100-GRN360-K1MK-VS Sn 95.5 Ag 3.9 Cu 0.6 Solder wire: Kester 24-7040-8834 Sn 96.5 Ag3.5 Regards,
Electronics Forum | Sat Dec 10 07:03:59 EST 2005 | mdemos1
Hi. I am trying to find out the minimum copper thickness I should see on a through hole barrel. The board has 1 ounce copper and the board thickness is 0.062". I am finding thicknesses of 0.6 to 1.2 mils. Thanks, Mike.
Electronics Forum | Wed Mar 14 13:52:11 EDT 2007 | Oswaldo Rey
Vias are thru hole, pcb is two sided, bottom copper is 2 sq inches, vias are 0.6mm diameter. thanks,
Electronics Forum | Wed Apr 18 21:35:26 EDT 2007 | davef
Thermal conductivity [W/m-*C] * Conformal coating [AR, ER, UR]: 17-21 * Epoxy molding compound: 0.6
