Electronics Forum: 0-3 (Page 16 of 18)

MPA or IP1 ?

Electronics Forum | Fri Jan 10 00:56:53 EST 2003 | fastek

You really must be on a tight budget since most people will pay YOU to take these models off their hands. What is your budget for capital equipment? Zero? That said, I think you would be better served to step up a generation and look at MPA-3's inste

X7R woes

Electronics Forum | Tue Jan 03 05:08:50 EST 2006 | Rob

Yes - as they flex less due to their size. I do have the calculations somewhere from my field apps days but it may take some time to find. The problems occuring with the X7R's MU

SN100C vs. SAC 305 wave soldering

Electronics Forum | Wed Jan 18 17:07:32 EST 2006 | gregoryyork

Sorry Bob Could not respond been away busy. Just to correct you, we did not copy the SACX as we brought ours to market at least six months before so how could we copy, it is also a little different, but nicely reassuring when the 'big boys' do some

Lead free tin copper only

Electronics Forum | Tue Feb 07 13:39:42 EST 2006 | gregoryyork

You can use straight forward Tin/Copper but it flows very poorly so solderability is an issue. Dosing with Phos improves this but need to stay on top of it. We have supplied some 3.8%Ag alloys for flow they work well but you get a small 'chill point'

Where to source SMD bulk cassettes?

Electronics Forum | Thu Nov 08 06:57:50 EST 2012 | pgarsoe

Murata designed the system: Promoting the Adoption of Bulk Cases An industry standard specification for bulk cases was adopted in March 1992. Although Murata holds the industrial property rights for this type of bulk case, we are encouraging its wid

Step-up stencil: recommendation thickness

Electronics Forum | Mon May 20 16:15:48 EDT 2019 | davef

Resources are: * IPC-7525A - Stencil Design Guidelines, 3.5.2 Step-Up Stencil This type stencil is useful when it is desirable to print thicker solder paste in a small portion of the stencil. An example would be a ceramic BGA where it is necessary t

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Apr 29 10:24:15 EDT 2021 | oxygensmd

I have the same issue but with one customer only. All the other have smaller or more difficult QFPs with really low bridging issues - close to no-one. I think the PCB and PCB design also an issue - other customers are using 32/64/100/144 QFPs and we

Samsung CP20CV

Electronics Forum | Thu Jun 01 16:46:40 EDT 2023 | assuredtech

We have the following Samsung CP20 spare parts and feeders available, we also have CP40 - CP45 spare parts and feeders available - please inquire. 1.) Fine Suntronix MRK OR4-H Power Supply 24V 16 Amp Output 2.) Y Axis Service AmplifierSanyo Denki PY0

Ag-plated LED dipping - high level of Cu and Ag

Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef

First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so

best buy? (printers)

Electronics Forum | Mon Nov 04 17:29:34 EST 2002 | pjc

Cannot comment on "best buy". You'll have to determine what the better machine is for your application and duration of planned use. I suggest taking a field trip to each vendor's nearest demo facility with a few of your most hi-tech boards and stenci


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