Electronics Forum: 0

What is Cu-EFTEC 64T?

Electronics Forum | Thu May 06 17:23:02 EDT 2004 | davef

Ah, here it is: EFTEC-64T. A commercial leadframe material with the nominal composition of Cu-0.3Cr-0.25Sn-0.2Zn

LED sticking into carrier tape

Electronics Forum | Tue Aug 01 11:23:56 EDT 2017 | OrHorti

We are using a custom made nozzle, designed for this particular LED. The dome of the LED is also custom made, the diameter of the lens at the base is 2.9mm while the substrate of the package is 3.3mm, so this gives about 0.2mm spacing between lens a

Temperature Profile for 0.2mm Thick ENIG Flex PCB

Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr

Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-

Rigid + Flex PCB Wave Solder?

Electronics Forum | Tue Feb 17 12:02:16 EST 2015 | allwave

If you do not want to invest in a wave pallet, then you'll have to find a way to equalize your thermal mass across the PCBA so your machine settings work for both "PCBs" (Ridig+Flex). My $0.02, George

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o

Hi Jandon, Thanks, I will try it on my DOE.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 21:47:41 EST 2019 | sssamw

Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97

Use a type 5 solder for maximum paste release.

large bga (55mmx44mm) capable placement machines?

Electronics Forum | Wed Sep 08 20:23:28 EDT 2004 | KEN

Philips Emerald & Emerald-X is specified at max 54mm device. However I have placed 58mm devices. These machines have published accuracies at 0.02mm. Have seen as low as 0.007mm.

Re: Fine Pitch Components

Electronics Forum | Mon Jul 24 18:41:07 EDT 2000 | Darby

Sorry, scale division on that would be 0.05mm not 0.02mm. Magnification x24 or thereabouts. Also great for measuring all sort of things on pcbs, stencils etc to see if they come within spec.

Offset for placed components?

Electronics Forum | Thu Aug 19 03:21:19 EDT 2004 | Evtimov

Hello all! Can you tell me what is the allowed offset for placed SMD component? Let's say for 0603 package(1.5mm,0.75mm the offset could be 0.2mm in X and Y ....) Where can I read about it? Thank you in advance.

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