Electronics Forum | Tue Aug 01 11:23:56 EDT 2017 | OrHorti
We are using a custom made nozzle, designed for this particular LED. The dome of the LED is also custom made, the diameter of the lens at the base is 2.9mm while the substrate of the package is 3.3mm, so this gives about 0.2mm spacing between lens a
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o
Hi Jandon, Thanks, I will try it on my DOE.
Electronics Forum | Thu Nov 14 21:47:41 EST 2019 | sssamw
Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.
Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97
Use a type 5 solder for maximum paste release.
Electronics Forum | Thu Aug 19 03:21:19 EDT 2004 | Evtimov
Hello all! Can you tell me what is the allowed offset for placed SMD component? Let's say for 0603 package(1.5mm,0.75mm the offset could be 0.2mm in X and Y ....) Where can I read about it? Thank you in advance.