0-25

"0-25" search results in the Electronics Forums



64 results found for "0-25" in the Electronics Forums

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Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Nov 14, 2019 | Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better

Dry solder

Jan 9, 2017 |

pcb manufacturing

Jan 13, 2016 |

Solder Clogging

Jul 3, 2010 |

ENIG CONTAMINATION

Nov 4, 2009 |

Label Printers

May 14, 2008 | FAQ from Electronic Imaging Materials site: I am using 0.25-inch high labels in sets of six. How do

0201

Feb 27, 2008 |

Solder voids in PTH

Feb 19, 2008 |

Screen cleaner evaluation

Feb 4, 2008 | 1.0mm (0.039") 1.75X >0.5 to 1.0mm (0.02 to 0.039") 4X 0.25 to 0.5mm (0.00984 to 0.02") 10X

Epoxy application

Nov 20, 2007 |

Board stop on DEK printer

Mar 29, 2007 | Size is 21mm (relaxed) x 4mm (OD) x 0.25mm wire... Manufacturer is Flexo Springs But for an in

Skewed components

Mar 19, 2007 |

BGA Tilt

Feb 9, 2007 | 0.25mm tilt? That's pretty small depending on you BGA size. Is it failing? Or just your Q.E. bein

BGA Tilt

Feb 8, 2007 | Hi All, What is the cause of BGA tilt ? I have a failed board and it seems to have approx 0.25

Fixture Material

Nov 1, 2006 |

Mis-alignment Headaches

Jul 11, 2006 |

Heat Sink for QFP

Mar 28, 2006 |

Fighting solder beads

Mar 20, 2006 |

Voids in Au finished Cu in Pb-free laser soldering

Feb 6, 2006 | Hi, We are electrodepositing Au(0.25 to 0.5 microns) on Cu & using solder ball bonding process via

uBGA placement

Sep 23, 2005 | Hi, Does anyone know if it's possible to place BGA's with pitch 0.5mm and ball diameter 0.25mm

manifold valve

Jul 7, 2005 |

Stencil thickness

Jun 16, 2005 | If the uBGA has aperatures that are 0.25mm square, you need to use a laser cut foil no thicker than

Stencil thickness

Jun 9, 2005 | 1. We do have PCB with 0402 component, Micro BGA ( 0.5mm pitch , 0.25 mm pad size ). PCB thickness

Volume of paste deposited with respect to board thickness

Jun 1, 2004 | I am currently looking at the volume of paste being deposited on a PWB 2.4mm thick with a 0.25mm tol

What is Cu-EFTEC 64T?

May 6, 2004 |

screen printer - vision

Apr 26, 2004 |

thru hole

Dec 17, 2003 |

0402 stencil design

Feb 4, 2003 |

PCB finish requirement for COB process

Sep 27, 2002 | I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.

Aluminum wire bonding

May 26, 2002 | We buy PCBs for aluminium wire bonding. Our PCBs have 0.25 mm square pads for bonding and 0.10 or 0

CCGA and overprinting?

Oct 15, 2001 |

Part sliding in reflow?

Apr 17, 2001 |

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