Electronics Forum: 0.12 (Page 1 of 3)

Missalingment 0402 Capasitor by Vision on TCM1000

Electronics Forum | Fri Oct 01 06:02:43 EDT 1999 | Bach Huss

Hi, We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision centering. The sy

Re: Missalingment 0402 Capasitor by Vision on TCM1000

Electronics Forum | Fri Oct 01 06:45:36 EDT 1999 | JAX

Hi, We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision centering.

Re: Missalingment 0402 Capasitor by Vision on TCM1000

Electronics Forum | Fri Oct 01 07:25:05 EDT 1999 | Wolfgang Busko

Hi, We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision cente

Solder bridges on TQFP 100 part

Electronics Forum | Wed Aug 07 17:20:17 EDT 2019 | orbitcoms

The aperture over the pads is set to 95% coverage of the pad. The stencil is 0.12 mm thick.

How to do with tombstoning for component '0402'

Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech

Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch

solution to design challenge (ubga, NSMD pads, heavy traces)

Electronics Forum | Fri Mar 27 03:42:17 EDT 2020 | sssamw

Did you try 0.12 or 0.1mm nano coated stencil @ 10 mil aperture? A soak time type profile with long reflow time could help.

Imm Silver tarnish?

Electronics Forum | Wed Sep 03 16:15:30 EDT 2008 | blnorman

Elemental is by SEM/EDX. The brown coloration does resemble the 3 micron photo. Again, if I'm picking up copper (our Ag plating thickness requirements are 0.05 micron to 0.12 micron following IPC 4553), maybe we do have a porous silver plating.

uBGA (.5mm pitch) printing woes

Electronics Forum | Thu Sep 07 07:36:57 EDT 2017 | tsvetan

we use 0.12 mm stencil with 0.3 mm apretures for 0.5mm step FBGA153 memory without problems the solder paste is SAC305 Class4 http://www.olimex.com/Products/Components/Soldering/SOLDER-PASTE-SAC305-CLASS4/

Fuji CP6 5000

Electronics Forum | Sun Jan 20 14:04:49 EST 2002 | cstech

We have a CP6 5000, please kindly inform us the optimal tact time is 0.09 or 0.12. Kindly confirm us the CP65 is same or different to CP6-5000. The CP6-4000 and CP6-500, any different, except on the table size? Hope to recieve your help?!

Fuji cp6 placement issues

Electronics Forum | Sun Jun 07 19:16:54 EDT 2015 | linux

Hello everyone, I'm looking for help with placement issue on our cp6 Fuji. On occasion we have to adjust co ordinates on the x and y axis usually about 0.12mm. Ball screw was replaced did not fix issue. Anything else we could try. Thanks everyone

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