Electronics Forum: 0.13 (Page 1 of 3)

Solder balls

Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef

IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00

minimum solder ball (bead) size

Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks

IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap

solder balls

Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve

The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac

Insufficient Solder Paste

Electronics Forum | Thu Dec 08 19:14:38 EST 2005 | khp_armin

We are encountering insufficient solder paste. Our stencil thickness is 0.13 mm and our printing pressure is 0.08 MPa our solder paste is Tamura TLF-204-19A. Please advice how to solve this problem.

bridging between 2 pads

Electronics Forum | Wed Nov 07 17:10:15 EST 2001 | davef

If you don�t paste / reflow solder on the pads, they will never bridge. ;-) A design with a 0.13mm gap between pads will challenge equipment, materials, and process.

PCB finish requirement for COB process

Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary

we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks

QFN soldering

Electronics Forum | Fri Nov 16 18:08:32 EST 2007 | mika

So you are saying that 0.13 mm stencil thichknes and 20% reduction of the middle cooling pad is working for you? Just as I said.. Best Regards, Mika Ps. Keep in mind that the QFN is designed to do some heavy work, while enough "heat transfer" occur.

versions MEdit, Fuji flexa

Electronics Forum | Wed Mar 30 12:29:55 EDT 2022 | ludo

hello, I am looking for information on new versions of Director fujiflexa and Medit. currently for Medit I am in version 18,4,0,13 and for Director fuji flexa I am in version 6,23,0,2 Is there a newer software version?

PQFP with pitch of 0.4 mm

Electronics Forum | Tue Jan 30 07:55:31 EST 2001 | ibi

I will have to process a PQFP 128 with a pitch of 0.4 mm. Given that the width of its leads are about 0.13-0.23 mm, i dread the worst when printing the solder paste. So, i would like to know if some people have yet test this type of fine pitch, what

What is the issue?

Electronics Forum | Fri Aug 07 20:07:16 EDT 2020 | emeto

Based on datasheet you can have balls with significant variation(twice volume) 0.13Sqr/0.19sqr = 0.46 I would suggest you tighten the machine recognition control. You will recognize BGA balls that are very different in size and reject the part. This

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