We manufacture multi PCB up to 12 layer,The details of our capabilities:*Micro fine line to 4 mil *Blind & buried via hole *Flying-probe testing *Carbonlack *FR4 thickness: 0.3/0.4/0.8/1.0/1.2/1.5/2.0/2.4/3.2mm *Small quantities are available *Golden finger *HAL & chemical tin
Soldering is now lead-free. Reflow soldering quality with solder paste can be maintained by controlling the furnace temperature or determining the temperature profile on condition that the solder paste material is decided and the materials, surface t
Ultra-High speed measuring Measuring rate up to 40 steps per second helps reduce tact times and can actually be used in fully automated production lines averting a bottleneck. This is indeed a unique strength of Hioki’s flying probe testers. Fine pi
Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon
Maybe something like this could work?
Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o
I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.
Reflow welding machine is a very important equipment in SMT production process. Reflow welding process directly affects the quality of SMT process. It is difficult to achieve good reflow welding quality without a good reflow A welding machine. 
Industry News | 2008-03-04 12:05:25.0
APEX, NC - January 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new iineo-II SMT platform in booth 1624 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, in Las Vegas.
Industry News | 2008-09-14 15:09:42.0
APEX, NC - September 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will showcase its iineo-II SMT platform in booth 423 at the upcoming IPC Midwest Conference & Exhibition that is scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.
Detailed Product Description Brand: SMC Part Name: Solenoid Valve Part Number: N510063838AA Model: VQZ1321-5M01-C6-X555 Origin: Japan Press: 0.2~0.7MPA SMC Solenoid Valve N510063838AA CM402/ CM602 Valve VQZ1321-5M01-C6-X555 Detail Information
SAMSUNG CP45 KOGANEI A040-4E1-64W VALVE 0.2-0.7MPa
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2009-09-18 14:42:37.0
In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil.
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Career Center | Appleton, Wisconsin USA | Engineering,Production,Research and Development,Technical Support
I have more than 25 years of experience in electronics manufacturing and printed circuit board (PCB) structural test. My forte is in-circuit test (ICT) program and fixture development and debug on the HP/Agilent 3070. I have more than 16 years of 3
% 0.3% 0.3% 0.3% 0.3% 0.3% 0.3% Biocide 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Water 35.5% 47.5% 36.5% 41.5 % 40.5% 46.5% 38.5% 52.5% 36.5 % 52.5% 19.5% 19.5% 19.5% 30.5% 25.5% 51.5% 69.5% 54.5% 53.5
- Goal Courtyard Excess Courtyard Round Hole Over Lead Min Annular Ring Min Fab Allowance Thermal ID Over Hole Thermal OD Over ID Spoke Width Pct Lead <= 0.40 Most 0.5 0.02 0.2 0.05 0.55 0.55 0.4 75 Nominal 0.25 0.02 0.15 0.05 0.45 0.35