Industry Directory: 0.2 (9)

New SMT Equipment: 0.2 (8241)

Semi Auto PCB Solder Paste Printer

Semi Auto PCB Solder Paste Printer

New Equipment | Solder Paste Stencils

KSUN Semi Auto PCB Solder Paste Printer Specifications : SMT Stencil Printer Machine Working area: 300*400-300*400mm(300*600mm,300*1200mm) Frame size: 370*470mm,420*520mm,550*650mm,1500*650mm PCB thickness: 0.2-4.0mm Voltage: Single phase 220V,5

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DEK Horizon 03iX Fully Automatic Printer

DEK Horizon 03iX Fully Automatic Printer

New Equipment | Solder Paste Stencils

DEK Horizon 03iX Fully Automatic Printer Model Horizon 03iX Operating System Win XP+09sp13 or up  PCB support Tooling  Magnetic tooling pins Camera type

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Electronics Forum: 0.2 (144)

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon

Maybe something like this could work?

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

Used SMT Equipment: 0.2 (169)

DEK Horizon 03i Printer

DEK Horizon 03i Printer

Used SMT Equipment | Screen Printers

DEK Horizon 03i automatic stencil printer Specification : DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100X middle speed Chip mounter

Yamaha YV100X middle speed Chip mounter

Used SMT Equipment | SMT Equipment

Name:YV100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip)                QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:100 Power Supply:3P/200V-416V/KVA Dimensions:1650X1408X1850mm

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: 0.2 (149)

'T' Series Bi-Metal Cutouts

Industry News | 2003-04-04 07:39:52.0

Designated T11L these have soldered connections for PCB circuits with a grid of 0.2 pitch

SMTnet

New Cost Competitive TCVCXO From Fox

Industry News | 2003-05-05 09:21:23.0

Features a 50% Reduction in Length

SMTnet

Parts & Supplies: 0.2 (1193)

Siemens Solenoid valve(A0101E-54W)

Siemens Solenoid valve(A0101E-54W)

Parts & Supplies | SMT Equipment

Solenoid valve(A0101E-54W) Wholesale original Koganei (KOGANEI) solenoid valves used for YAMAHA SMT machine YV100A, YV100II, YV100X, YV100XE, YV100XG, YG200 KM1-M7163-30X 44W vacuum solenoid valve KM1-M7163-20X 37W blowing solenoid valve

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha Solenoid valve A040-41E-56W

Yamaha Solenoid valve A040-41E-56W

Parts & Supplies | SMT Equipment

Solenoid valve A040-41E-56W Wholesale original Koganei (KOGANEI) solenoid valves used for YAMAHA SMT machine YV100A, YV100II, YV100X, YV100XE, YV100XG, YG200 KM1-M7163-30X 44W vacuum solenoid valve KM1-M7163-20X 37W blowing solenoid valve

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: 0.2 (2)

Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting

Technical Library | 2015-05-28 17:34:48.0

The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.

Panasonic Factory Solutions Company of America (PFSA)

Dispensing Solder Paste Micro-Deposits to 0.2mm - A Process Solution

Technical Library | 2007-01-03 16:36:58.0

Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste formulations, more precise equipment, and more tightly controlled processes is driving paste suppliers and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today’s electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits.

Nordson EFD

Videos: 0.2 (247)

fast Measuring Instrument,image measuring instrument, PCB Vision Measuring Machine

fast Measuring Instrument,image measuring instrument, PCB Vision Measuring Machine

Videos

https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,

ASCEN Technology

Round Blade PCB Cutting V cut Machine ML 508

Round Blade PCB Cutting V cut Machine ML 508

Videos

Suitable for diversified glass fibre board, FR-4 board, aluminum board, etc, especially for the PCB with components on both sides. If you have any question about the machine, please feel free to contact e-mial : bella@qy-smt.com

Qinyi Electronics Co.,Ltd

Career Center - Jobs: 0.2 (1)

Software Engineer-Passport Team

Career Center | Dallas, Texas USA | Engineering

Skills/Requirements: BSCS w/3.0 min GPA, 0-2+ years experience using rational rose or similar OO case enviornment UML or comparable rotation scheme, Win NT, Networking communications, embedded systems; Must also know object oriented analysis, design

EMSR, Inc.

Career Center - Resumes: 0.2 (2)

resume

Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing

• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.

Glenn Brown for 3070 ICT Development

Career Center | Appleton, Wisconsin USA | Engineering,Production,Research and Development,Technical Support

I have more than 25 years of experience in electronics manufacturing and printed circuit board (PCB) structural test. My forte is in-circuit test (ICT) program and fixture development and debug on the HP/Agilent 3070. I have more than 16 years of 3

Express Newsletter: 0.2 (8)

Partner Websites: 0.2 (372)


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One stop service for all SMT and PCB needs

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