Electronics Forum | Thu Nov 14 21:47:41 EST 2019 | sssamw
Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.
Electronics Forum | Tue Jun 25 09:55:25 EDT 2013 | bandjwet
We are looking for a recommendation for a company that can perform solder ball inspection on BGAs. The devices are in trays and the the challenge is the ultra fine pitch (0.4mm) and ball size (0.25mm diam). We are looking for ball diameter and coplan
Electronics Forum | Thu Jun 16 18:19:05 EDT 2005 | Jason Fullerton
If the uBGA has aperatures that are 0.25mm square, you need to use a laser cut foil no thicker than 3.75 mils to get an area ratio of 0.67, which is the minimum rule of thumb - that's too thin! Electroform would probably work up to 4.5 mils thick.
Electronics Forum | Wed Oct 15 12:32:19 EDT 2003 | Gregg
We are looking at a design that has an smt led emiter and a corresponding smt detector. After reviewing the tolerance stackup, we need a reflowed placement accuracy of +/-0.25mm(+/-0.010") for each component. Any thoughts/opinions?
Electronics Forum | Thu Feb 08 14:03:39 EST 2007 | dave
Hi All, What is the cause of BGA tilt ? I have a failed board and it seems to have approx 0.25 mm difference in height on one edge of the BGA to the other. It is notable under magnification. Is this caused by to much time above reflow temp or not