Electronics Forum | Sun Oct 18 03:01:41 EDT 2020 | rsatmech
Hi All, Thanks for your response and support. Attached is the design used. I found out the below design details in another model. Can used this also. 0.28x0.24 mm is the dimensions available in other model (no tombstone issue occurring).
Electronics Forum | Mon Sep 03 10:50:47 EDT 2007 | kissanepat1
A suggestion for your stencil which works is as follows. Cut your stencil aperatures beyond your pads to a length of 0.1mm , this then allows the paste to pull back into the pad creating a blob of solder which can be inspected by AOI.Best length and
Electronics Forum | Tue Dec 21 16:47:15 EST 1999 | GERARDIN
Hello Pascal As mentioned by Wolfgang the key issue is the printing process capability. For a thick copper level 90�m we noticed that the pad reduction can be greater than 20% depending on supplier sources. Typicaly for a cad Width = 0.4 we can
Electronics Forum | Fri Aug 06 03:51:06 EDT 1999 | Thomas
Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. My regular stencil manufacturer recommend the following: Thickness: 8 mils 0805 opening: Oblong 0.35 X
Electronics Forum | Mon Apr 06 09:04:31 EDT 2015 | jesseoliveira
Hi all! I work in FA Lab on Brazil. Recently we had a problem with a dye pry analysis of BGA component due to breakage of WLP package (wafer level packaging). In this case, WLP thickness is about 0.28mm and was damaged during pullout process. Our
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Sat Aug 07 11:10:03 EDT 1999 | JohnW
| Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. | My regular stencil manufacturer recommend the following: | Thickness: 8 mils | 0805 opening: Oblong
Electronics Forum | Wed Jun 10 17:30:44 EDT 1998 | FAC
When creating part data�s for BGA or QFP style components, the line scan camera will be utilized (Camera No. 4). Using a Single nozzle type placing head, a nozzle capable of sufficient vacuum, and front lighting the part can achieve placement of a 74
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