Electronics Forum | Wed Aug 02 05:25:01 EDT 2017 | pandamw
Model : PD045105-2S 50 Ohm 2 way SMA-Female Power Divider From 0.45 to 10.5 GHz Rated at 30 Watts; 10.5GHz, SMA-Female Power Divider; Insertion Loss 1.0dB; Isolation 20dB; Operating Temperature -40 to +70℃. Frequency Range | GHz : 0.45-10.5 Impeda
Electronics Forum | Thu Aug 05 04:51:37 EDT 2004 | Bryan
The ball pitch is 1.10mm and the pad diameter is 0.45mm,so we designed the aperture diameter as 0.45 on 0.13mm thick stencil.Bridging rate decreased a great deal,but the balls still deformed in the same area.and found it no use reducing the reflow ti
Electronics Forum | Mon Jan 24 08:42:25 EST 2005 | SLVito
Morning All, I have to choice between two axial through hole machines: Panasert AVK 3 and Universal VCD Sequencer 8. I will insert axial components with 0,45 mm to 0,8 mm component lead diameter and perform jumper wire insertion in the same machine.
Electronics Forum | Wed Jan 26 05:24:56 EST 2005 | SLVito
Morning All, I have to choice between two axial through hole machines: Panasert AVK 3 and Universal VCD Sequencer 8. I will insert axial components with 0,45 mm to 0,8 mm component lead diameter and perform jumper wire insertion in the same machine.
Electronics Forum | Mon Aug 25 22:14:34 EDT 2003 | davef
You need a nylon with a heat deflection temperature [heat distortion temperature] - 0.45MPa ( C ) similar to your reflow peak. The HDT of the nylon in your connector is probably ~200*C. For more, look here http://www.tycoelectronics.com/environment
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Thu Jan 31 09:08:27 EST 2008 | glezfl36
Since the implementation of the ROHS process in our Company with the higher temp requirements, we had observed an increase in problems related to delamination in the PCB's. Actually we are using FR408 and Gracescore materials and are changing to a Ve
Electronics Forum | Tue Aug 28 14:21:39 EDT 2001 | Scott B
You have to be careful here. The figure is expressed as placement accuracy, not process quality therefore 3 sigma does not relate to 2700 PPM defects but 2700 parts per million placed outwith 15microns (0.0006" / 0.6thou). Extrapolating the distribu
Electronics Forum | Thu May 13 19:43:57 EDT 2004 | My Nguyen
Hello all: We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip) BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch:
Electronics Forum | Mon Jan 31 05:25:54 EST 2005 | gaurav
Morning All, > > I have to choice between two > axial through hole machines: Panasert AVK 3 and > Universal VCD Sequencer 8. I will insert axial > components with 0,45 mm to 0,8 mm component lead > diameter and perform jumper wire insertion in t
.gif)