Electronics Forum: 0.75 (Page 1 of 7)

Concerned with processing 0.75mm c-c Pitch BGA

Electronics Forum | Tue Jan 07 15:03:25 EST 2003 | ksfacinelli

I have a client interested in using a Toshiba Part P-TFBGA48-0607-0-0.75AZ. Mechanical data on the part can be found at: http://www.toshiba.com/taec/components/Datasheet/51WHM516AXBN.pdf I am concerned with being able to use this part with consist

Component Testing for RoHS

Electronics Forum | Fri Nov 18 03:24:08 EST 2005 | Slaine

the two desk top units i have measure an area around 0.75mm square.

Min spacing for land patterns from PCB edge

Electronics Forum | Thu Mar 20 16:53:32 EDT 2008 | guhansub

Min spacing will be 0.75'' on all the 4 edges

Acceptance Criteria Ion Chromatography testing?

Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef

rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 ||Bare board final surface finish Ions||Hot air solder level||OSP over copper||Gold over nickel Chloride||0.75 ug/cm^2||0.75 ug/cm^2

SMD flatness standard

Electronics Forum | Mon Nov 20 19:49:03 EST 2006 | davef

Sorry for stating this incorrectly. It should been: Bow & twist for bare boards and panels: IPC-A-610 Acceptability of Electronic Assemblies, 10.6: 1.5% for PTH only and 0.75% for SMT, acording to test method TM-650, method 2.4.22 IPC-6012, par. 3.

PCB finish requirement for COB process

Electronics Forum | Fri Sep 27 10:05:07 EDT 2002 | oconnorp

I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.

Offset for placed components?

Electronics Forum | Thu Aug 19 03:21:19 EDT 2004 | Evtimov

Hello all! Can you tell me what is the allowed offset for placed SMD component? Let's say for 0603 package(1.5mm,0.75mm the offset could be 0.2mm in X and Y ....) Where can I read about it? Thank you in advance.

BGA rework

Electronics Forum | Fri Nov 09 10:25:43 EST 2001 | steven

is it all right to reflow a BGA using a rework station but without applying a layer of solder paste on pcb. the diameter of the solder ball is 0.75 and the pitch is 1.5mm.

What is a good spec for board warpage?

Electronics Forum | Wed Dec 19 09:23:47 EST 2001 | davef

Bow & twist for bare boards and panels: IPC-A-610 1.5% for PTH only and 0.75% for SMT

0.4mm pitch CSP Dummy Component

Electronics Forum | Wed Mar 06 07:13:23 EST 2002 | PeteC

nope, only placed 0.75mm pitch myself. I looked around some data sheets and did not find any 0.4mm.

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