Electronics Forum: 0.8mm vias cinsideration (Page 1 of 1)

Design rule for vias

Electronics Forum | Wed Dec 06 21:28:12 EST 2006 | davef

It's worse than just using the test equipment manufacturer guidelines. Along with that, you have to deal with each of the test fixture fabricators' preferences as well. What this boils down to is a negotiation with the test engineering group as to w

Shielding from Nearby Heat-Any Tricks

Electronics Forum | Wed Dec 24 11:49:46 EST 2008 | bandjwet

Put on your thinking caps for this one......We are trying to remove a BGA (10 x 10mm, plastic, 0.8mm pitch) which is approx 3 mm next to another BGA (5 x 5mm, plastic, 0.8mm pitch). The challenge is this second device is underfilled with a softening

changing from no-clean to clean

Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef

Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.

Re: Micro Vias in Pads

Electronics Forum | Mon Mar 30 16:02:44 EST 1998 | Michael Allen

We have successfully put .016" vias in .030" pads. There is no issue with .030" solder balls, since the actual volume of the .002" via in pad is small compared to the ball+solder paste volume. We did notice random bubbles where, apparentl

Solder Spheres, JEDEC Package Tolerances

Electronics Forum | Mon May 29 07:46:30 EDT 2006 | bwet

In reviewing the JEDEC 95 guidelines (2002) there is not a mention of tolerances that have been agreed upon for today's finer pitch devices. There was no mention of the solder diameter tolerances (low melt temp) allowed for 0.8mm, 0.6mm and 0.5mm pit

Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 09:36:35 EST 1999 | Parvez Patel

Hi Everyone, We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concerns fo

Re: Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon

Hi Everyone, We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern

Re: Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 16:31:09 EST 1999 | Steve Gregory

Hi Everyone, We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern

Re: Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon

Hi Everyone, We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con

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