Electronics Forum: 017 (Page 1 of 3)

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Mon Mar 26 11:20:39 EST 2001 | dblsixes

The pads are 0.070 x 0.012 ... as spec'ed, and as measured. The pad extends approximately 0.017 behind where the Class 3 fillet is required to be. (It used to be 0.037 on an older design that exhibited similar, but not as bad of heel fillets.)

BGA Sphere Reflow

Electronics Forum | Thu Mar 02 15:12:50 EST 2000 | Robert Hartmann

To restate my question of earlier, if I have a .020" sphere before reflow, and my pad opening in the dielectric is .017", is there a rule of thumb to calculate the height of the sphere after reflow? We are using 62Sn/36Pb/2Ag spheres. This should h

BGA Sphere Reflow

Electronics Forum | Thu Mar 02 15:12:50 EST 2000 | Robert Hartmann

To restate my question of earlier, if I have a .020" sphere before reflow, and my pad opening in the dielectric is .017", is there a rule of thumb to calculate the height of the sphere after reflow? We are using 62Sn/36Pb/2Ag spheres. This should h

Are there small pick & place machines for low volume?

Electronics Forum | Wed Feb 01 15:54:07 EST 2006 | Rick

I need to place one type of part (0.080x0.017x0.010 inches) on a flat wire with an accuracy of about +/-0.010 in any direction. Volumes to be about 500 to 1000 per day. Are there any relatively small pick and place machines available?

fine pitch printing

Electronics Forum | Wed May 17 13:48:37 EDT 2006 | dwelch123

I'm having trouble printing leads on a fine pitch part. The lead is only .008". I'm using a DEK 265 with metal squeegee and using WS200 multicore solder paste.The stencil is laser cut and polished. I've experimented with different pressures and diffe

Flux encapsulant

Electronics Forum | Mon Apr 01 23:16:44 EST 2002 | dwoon

Hi, Heard about flux encapsulant - a compression-flow flux and underfill product for flip chip assembly. It eliminates the need for a separate underfill operation. Does anyone has experience in actual production run? What is the possible effect for

Type 3 powder with BGA

Electronics Forum | Mon Feb 21 17:56:44 EST 2005 | davef

You want approximately 5 particles minimum across the smallest aperture. So in the case of a 0.8mm device, we use .017" pads with a round 0.020" aperture on a 6 thou thick stencil foils. Here, 0.020" diameter equals 0.50mm. This gives us 0.50/5=10

Solder wetting issues

Electronics Forum | Thu Dec 01 14:24:25 EST 2005 | Amol Kane

Hi, I am having a SAC 305 solder paste with water soluble flux wetting issue. during reflow, the solder melts, but doesnt flow. the reflow profile was developed by the solder company person (Kester). the board is a test assembly to validate our LF pr

Affect of Solder Mask on Heat Dissipation

Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef

Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co

Re: footprint formula

Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko

Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir

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