Electronics Forum: 020 (Page 1 of 26)

Baking of MSD devices

Electronics Forum | Wed Nov 29 20:49:14 EST 2006 | davef

According to J-STD-033B, 3.1 Requirements: The levels are determined per J-STD-020 and/or per JESD22-A113 plus reliability testing. Look here: http://www.jedec.org/download/search/jstd020c.pdf

MLF / QFN Lead Free Shorting

Electronics Forum | Mon Apr 09 14:53:19 EDT 2007 | flipit

Hi, We were running with few defects with lead solder paste. The lead solder paste with stencil 0.010" X 0.020" and 0.004" thick stencil produced near defect free PCB assys. 0.010" X 0.020" (0.004" thick) lead = defect free 0.010" X 0.020" (0.005"

0402

Electronics Forum | Tue Jun 07 19:24:44 EDT 2005 | russ

We use a .010" - .012" gap with .020" square pads.

SMTnet featured article

Electronics Forum | Fri Jan 04 09:01:35 EST 2008 | davef

Here's a link to the article that Loco references in the above post: http://www.smtnet.com/library/files/upload/DevelopingaReliable.pdf The table seems to be taking a simplistic approach. J-STD-020C, Table 4-2 lists nine catagories of MSL classific

Re: dpmo

Electronics Forum | Thu May 18 15:04:13 EDT 2000 | Dirk McCoy

I have heard the following from various sources (that I believe) that apply to volume manufacturers as of late last year: dpmo with BGAs- 300 dpmo with .020" pitch- 75 dpmo with 0402s and .020" pitch- 40 Our lines run around 90-200, but have some p

Re: 8 mil placement, part Deaux!!

Electronics Forum | Fri Sep 11 16:52:00 EDT 1998 | Dave F

0.050" -> 50 mil -> 50 pitch 0.80 mm -> 0.032" -> 32 mil -> 32 pitch 0.64 mm -> 0.025" -> 25 mil -> 25 pitch 0.50 mm -> 0.020" -> 20 mil -> 20 pitch 0.40 mm -> 0.016" -> 16 mil -> 16 pitch 0.20 mm -> 0.012" -> 12 mil -> 12 pitch Dave F

PCB Through Hole Size for Lead Free

Electronics Forum | Thu Nov 08 19:56:08 EST 2007 | davef

Josh: Your 0.009" [0.228 mm] clearance should be fine. The minimum clearance should be ~0.008" [0.20 mm]. Is the 0.039" [0.99 mm] the measured or the expected hole diameter? While we wouldn't like it, we wouldn't be surprised to see 0.008" [0.20 mm

IPC Land Pattern Guideline

Electronics Forum | Thu Oct 20 20:44:15 EDT 2011 | davef

Design based on: * IPC-SM-782A: Gap 0.0157", Pad 0.0354"X0.0276" [along gap] * IPC-SM-782A Mod used on 32411A1 & Volvo Smart Switch: Gap 0.0157", Pad 0.020"X0.020" [along gap] * IPC-7351: Gap 0.008", Pad 0.0256"X0.0256" [along gap]

Re: 8 mil placement, part Deaux!! / My Mistake - Sorry

Electronics Forum | Mon Sep 14 09:25:49 EDT 1998 | Dave F

0.050" -> 50 mil -> 50 pitch | 0.80 mm -> 0.032" -> 32 mil -> 32 pitch | 0.64 mm -> 0.025" -> 25 mil -> 25 pitch | 0.50 mm -> 0.020" -> 20 mil -> 20 pitch | 0.40 mm -> 0.016" -> 16 mil -> 16 pitch | 0.20 mm -> 0.012" -> 12 mil -> 12 pitch | Dave F Y

Type 3 powder with BGA

Electronics Forum | Mon Feb 21 17:56:44 EST 2005 | davef

You want approximately 5 particles minimum across the smallest aperture. So in the case of a 0.8mm device, we use .017" pads with a round 0.020" aperture on a 6 thou thick stencil foils. Here, 0.020" diameter equals 0.50mm. This gives us 0.50/5=10

  1 2 3 4 5 6 7 8 9 10 Next

020 searches for Companies, Equipment, Machines, Suppliers & Information

High Throughput Reflow Oven

Wave Soldering 101 Training Course
SMT spare parts - Qinyi Electronics

High Precision Fluid Dispensers
AI Data Center Hardware Manufacturing

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Formic Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications


500+ original new CF081CR CN081CR FEEDER in stock