Electronics Forum | Mon Mar 03 08:33:54 EST 2003 | msivigny
Hello bphillips, I'm not surprised you're having difficulties with this size chip. As technology advances in product development continue to shrink package and real-estate size, the equipment and its automation must continue to perform it's desired f
Electronics Forum | Fri Jan 28 15:40:57 EST 2005 | gregp
I think you should talk to the placement machine engineer type.
Electronics Forum | Wed Dec 14 11:06:12 EST 2011 | swag
Thanks, Dave. Really good article.
Electronics Forum | Tue Sep 09 19:38:18 EDT 2014 | jimmyboz
My guess is it started working today?
Electronics Forum | Wed Sep 21 15:43:13 EDT 2022 | emeto
If you replicate this design, stay away from the silk screen shown on the picture.
Electronics Forum | Wed Sep 21 15:49:45 EDT 2022 | markhoch
I agree. The silkscreen will cause a gasketing issue with the stencil.
Electronics Forum | Mon Jan 03 14:00:06 EST 2000 | John Anderson
Has anyone had luck with 0201 cap board design, solder printing and reflow? IPC-SM-782 does not provide much help. I am particularly interested in attach pad design, stencil aperture design and thickness, solder paste (mesh, metal content, etc.), and
Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb
On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t
Electronics Forum | Mon Mar 17 20:50:34 EDT 2008 | keithej2
SMT Research has offered to sell us 0.4mm nozzles for tests. Even if the camera worked with the nozzles and parts (which I doubt) I don't think the CP4 has the x-y accuracy to place 0201s well. We'll see, they are ordering the nozzles, test parts and
