Electronics Forum: 0201 and test (Page 1 of 39)

0201

Electronics Forum | Thu Jun 14 23:21:30 EDT 2001 | oem boy

I am working on 0201 development for my company in the UK, and I am planning a rather extensive DOE for my reflow oven profile. I am planning on studying various ramp rates, soak times, times above liquidus, peak temps, etc... My biggest concern

0201

Electronics Forum | Fri Feb 22 13:24:24 EST 2008 | mulder0990

How did I know senior was going to get in here too. Nice to see you again. I figured as much with the height difference, but I do not have the equipment here to test my thoughts. We somehow have our machine dialed in to run the 0201 parts with W

0201 and Lead Free

Electronics Forum | Tue Dec 13 09:29:08 EST 2011 | swag

We're soon to build a lead free assembly with 0201 components. I'm not worried about placement as our machines can handle it. Any tips on printing, screens, reflow?

0201 and uBGA

Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick

Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a

0201 and uBGA

Electronics Forum | Wed Sep 25 06:56:16 EDT 2002 | CH

U may check your profile ramp rate. The flux may evporated and look like cold joint

0201 and Lead Free

Electronics Forum | Wed Dec 14 11:06:12 EST 2011 | swag

Thanks, Dave. Really good article.

0201 and uBGA

Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb

On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t

0201 and uBGA

Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef

Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?

0201 and uBGA

Electronics Forum | Wed Sep 25 13:38:35 EDT 2002 | finepitch

Yannick, If we leave the 201 issue aside; have you checked where those BGA pads are connected to? Could those be power/ground balls connected to large (difficult to heat up) planes by any chance? Erhan

0201 and Lead Free

Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef

A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition

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