Electronics Forum | Wed Mar 26 20:48:22 EDT 2008 | davef
Sealing clip, clamps used in semiconductor, hybrid packaging * Connor Manufacturing Services; 16233 N.E. Cameron Blvd., Portland, OR 97230; 503-256-0230 F503-256-0246 connorms.com * Electro Assembly Source; 602 Sciandro Dr, Greensburg PA 15601; 724-8
Electronics Forum | Fri Jun 03 16:52:48 EDT 2005 | davef
Your customer is being smart. When we look at the evaluation that some component suppliers do in assessing the potential of the pure tin solderability protection they've chosen to produce tin whiskers, we just shake our heads. Essentally they say,
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
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