Electronics Forum | Wed Oct 14 22:05:45 EDT 1998 | Jason
John, Universal has a smaller footprint HSP chipshooter, I believe the 4795S and the 4796R that takeup a lot less space than the full sized chipshooters do. I have a 4795S, it's just as reliable as our full sized 4795's & 96's. As far as BGA's I pr
Electronics Forum | Thu Oct 15 08:06:17 EDT 1998 | Sjef van Gastel
|John, Why do not you consider the Philips Powerline concept ? The Powerline consists of the combination of FCM and ACM. These 2 machines represent the best in class in SMD placement. The FCM can accomodate 96 8 mm tapefeeders, while the ACM can ac
Electronics Forum | Fri Oct 16 12:45:23 EDT 1998 | smd
| | | I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine pi
Electronics Forum | Sat Oct 17 08:03:47 EDT 1998 | Stefan Witte
I think the Universal and the Siemens machine are a good marriage. However, dealing with two different vendors may create additional difficulties. As both parties want to make the deal with you, you might want to bypass the sales people to get more i
Electronics Forum | Fri Sep 10 12:06:45 EDT 1999 | The Guc
| | | | I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine
Electronics Forum | Wed Jun 24 18:41:23 EDT 1998 | Bill Chrisitian
| Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exactl
Electronics Forum | Thu Jun 25 11:53:09 EDT 1998 | Dave F
| | Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exac
Electronics Forum | Fri Apr 03 08:37:10 EST 1998 | Scott Cook
| We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisation is
Electronics Forum | Wed Oct 17 13:02:41 EDT 2001 | Yngwie
We are running Clean process. solder beadings were found after the wash process. Weird eh!! It's true.. Details: 1)wash pressure ? No shadowing effects from high profile component. It also happened on the component's body of the 1210 & 0402 caps whi
Electronics Forum | Wed Dec 19 01:17:13 EST 2001 | ianchan
Hi Experts, I need help here, advice appreciated from all... Production is running a Lot of flex-circuit PCB, through the SMT line, with 0402 components. The flex-PCB is taped to FR4 support "pallets" when processing thru' the SMT P&P m/c. We use
